“…Cu and Ag) have been produced by electrodeposition on non-metallic substrates as boron-doped diamond [8]. Furthermore, arrays made of non-metallic microelectrode as diamond based material [8,[49][50][51], carbon based materials [52][53][54][55] Several thin metal or multiple metals layers (few tens of nm), deposited between the supporting substrate and the electrode material, have been explored to promote adhesion; Ta [58], Ti [24], Al [28,[59][60][61], Cr [60,62] or composite layer as Ti/Pt sandwich (30:50 nm) [45] and Ti/Ni (50:50 nm) [46,63] have been used as adhesive layer for Ir [24,25,58], Au [44][45][46]60,62] and Pt [59][60][61].…”