1998
DOI: 10.1002/(sici)1521-4109(199802)10:2<89::aid-elan89>3.3.co;2-a
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Analytical Characterization of Microlithographically Fabricated Iridium-Based Ultramicroelectrode Arrays

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Cited by 8 publications
(12 citation statements)
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“…Several metals as Ir [7,10,[24][25][26][27][28][29][30][31][32][33][34][35][36][37][38][39][40][41][42][43], Au [44][45][46][47], Pt [45,47], Rh and Rh/Ir alloys (Ir0.9Rh0.1) [28] and HgAg amalgam [48] have been patterned using photolithographic approaches. Other metals micro-electrode arrays (e.g.…”
Section: Ii1a Micro-electrode Array Fabricationmentioning
confidence: 99%
See 1 more Smart Citation
“…Several metals as Ir [7,10,[24][25][26][27][28][29][30][31][32][33][34][35][36][37][38][39][40][41][42][43], Au [44][45][46][47], Pt [45,47], Rh and Rh/Ir alloys (Ir0.9Rh0.1) [28] and HgAg amalgam [48] have been patterned using photolithographic approaches. Other metals micro-electrode arrays (e.g.…”
Section: Ii1a Micro-electrode Array Fabricationmentioning
confidence: 99%
“…Cu and Ag) have been produced by electrodeposition on non-metallic substrates as boron-doped diamond [8]. Furthermore, arrays made of non-metallic microelectrode as diamond based material [8,[49][50][51], carbon based materials [52][53][54][55] Several thin metal or multiple metals layers (few tens of nm), deposited between the supporting substrate and the electrode material, have been explored to promote adhesion; Ta [58], Ti [24], Al [28,[59][60][61], Cr [60,62] or composite layer as Ti/Pt sandwich (30:50 nm) [45] and Ti/Ni (50:50 nm) [46,63] have been used as adhesive layer for Ir [24,25,58], Au [44][45][46]60,62] and Pt [59][60][61].…”
Section: Ii1a Micro-electrode Array Fabricationmentioning
confidence: 99%
“…6,7 An environmental UME application includes heavy metal detection in natural water systems where very little or no analyte is present. 8,9 Fabrication of UMEs in undergraduate laboratories is a difficult and time-consuming process that requires experimental skill and patience. 3 These tedious methods can involve the use of dangerous chemicals, multiple fabrication steps, and the creation of waste.…”
Section: ■ Previous Ume Fabricationmentioning
confidence: 99%
“…A variety of electrode substrates have been used for the determination of Cu 2+ . These have included a mercury-plated iridium microelectrode array (Ir-UMEA), a thin-film gold electrode, a carbon-disk microelectrode, a hanging-mercury-drop electrode, a mercury-film electrode, and a mercury-plated platinum microelectrode array . On-site analysis of copper has been performed using a mercury-film glassy-carbon electrode …”
mentioning
confidence: 99%