Analytical estimation of fracture toughness for circumferential cracks in thin hard films on ductile substrates

Abstract

In this study, the fracture toughness of circumferential crack caused by indentation effect of a rigid indenter on a thin and elastic coating deposited on the elastic substrate was calculated. In the coating and substrate, the analytical solution of displacement and stress field was used. The complete adhesion was considered for the coating on the substrate. The location of maximum circumferential stress was investigated using the analytical calculation of the stress and it was found that this place was located at a distance away from the center of the indenter. Then, the stress intensity factor and energy release rate for plane strain state was determined, and consequently, the energy release rate for a channel crack was calculated. Finally, the fracture toughness was calculated with energy release rate curves for plane strain crack and crack channeling. This method was used to calculate the fracture toughness of TiN/TiCrN ceramic multilayer coating which was deposited on the GTD450 substrate using the Cathodic Arc PVD method. To validate the results, the analytically calculated crack radius was compared with the experimental crack radius in the fracture load and the difference between the radiuses was in the acceptable range.