Analytical Optimization of High Performance and High Quality Factor Mems Spiral Inductor

Pirouznia, Parsa; Ganji, Bahram Azizollah

doi:10.2528/pierm13121908

Cited by 22 publications

(10 citation statements)

References 12 publications

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“…To determine the characteristics of a spiral inductor, three parameters such as Q ‐factor, inductance and self‐resonance frequency are usually used as merit number [17]. These parameters determine spiral inductor performance.…”

Section: Analysis and Designmentioning

confidence: 99%

Design of small size and high sensitive less‐invasive wireless blood pressure sensor using MEMS technology

Ganji

Kheiry

Soleimani

2018

IET Circuits, Devices & Systems

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This study presents an implantable passive wireless blood pressure sensor using an inductive coupling wireless sensing technique that is designed for long-term monitoring of blood pressure in hypertension patients. This sensor includes a gold tapered square spiral inductor and a circular capacitor with a polyimide diaphragm. The purpose of this study is to minimise the dimension of the sensor due to the limitation of space around the vessel; therefore, a microelectromechanical systems (MEMS) inductor and a capacitor with small dimension and high sensitivity are used. In this structure, the diaphragm is deflected by applied pressure which capacitance and then resonance frequency are changed. These changes are sensed remotely with inductive coupling, which eliminates the need of wires connection for monitoring. In this method, a blood pressure signal can be obtained by measuring the impedance phase dip from the external coil. The distance between two coils is 8 mm. The sensor is designed to provide a resonance frequency range of 282-381 MHz for a pressure range of 0-250 mmHg. Simulation has been done using COMSOL Multiphysics and ADS software. The dimension of the sensor is 2.2 mm × 2.2 mm and the sensitivity of the sensor is 1550. This sensor has a small size and high sensitivity rather than previous works.

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Section: Analysis and Designmentioning

confidence: 99%

Design of small size and high sensitive less‐invasive wireless blood pressure sensor using MEMS technology

Ganji

Kheiry

Soleimani

2018

IET Circuits, Devices & Systems

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“…It is a technology used to minimize systems. Electrical components such as inductors and capacitors can be significantly improved compared to their integrated counterparts when manufactured using MEMS and Nanotechnology [9,10].…”

Section: Introductionmentioning

confidence: 99%

Modeling and thermal analysis of micro beam using COMSOL multiphysics

et al. 2021

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In this study, the design and analysis of the micro beam is carried out using COMSOL Multiphysics. The current passing through the beam distributes the heat energy due to its resistance that pushes the entire micro beam to the desired distance through thermal expansion. This expansion varies depending on the amount of current passing through the beam and the emitted temperature. The purpose of the model created is to estimate the amount of current and temperature increase required to cause displacement in the proposed micro beam using analysis software. In addition, displacements and temperature data produced in micro beams for different metallic materials (aluminum, copper, nickel, and platinum) and different input potentials (0.3V, 0.6V and 0.9V) are reported. These materials are used as functional materials in the field of micro-electro-mechanical-system (MEMS) because of their important physical and electrical properties. As a result of the simulation studies, increasing the voltage increased the displacement in the materials and the resulting temperature. While there is a serious difference between the displacement data of the materials, the temperatures are close to each other. When 0.9V voltage is applied, the highest displacement values for aluminum, copper, nickel and platinum are; 7.88 ?m, 5.36 ?m, 3.62 ?m, and 2.72 ?m, respectively. As a result, it has been observed that aluminum used in micro beam design gives a significant amount of displacement for the proposed geometry when compared to other metallic beams.

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“…However, on-chip inductors normally exhibit low Q factor [3,4]. Particularly, CMOS-based inductors suffer due to their low quality factor [5,6]. Alternatively, Microelectromechanical systems (MEMS) inductors offer better performance in terms of the Q-factor and selfresonance frequency (SRF) [7].…”

Section: Introductionmentioning

confidence: 99%

Investigation of on-chip integrated inductors fabricated in SOI-MUMPs for RF MEMS ICs

Khan

Younis

2020

Analog Integr Circ Sig Process

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This paper presents for the first time implementation of zig-zag and solenoidal on-chip inductors in standard and cost effective SOI-MUMPs fabrication process. The solenoidal inductor offers high Q-factor and inductance as compared to planar zig-zag inductor. Bonding wires are used to construct the top conductor loop of the solenoidal inductor. The inductors are also characterized at elevated temperature for performance investigation in harsh environment. The mechanical resonance frequency of the inductors are characterized using the Finite element software COMSOL. The inductors are characterized using a vector network analyzer from 60 MHz to 3 GHz, and the results of both inductors are compared. The total size of the device is 2×0.7mm 2 .

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Analytical Optimization of High Performance and High Quality Factor Mems Spiral Inductor

Cited by 22 publications

References 12 publications

Design of small size and high sensitive less‐invasive wireless blood pressure sensor using MEMS technology

Design of small size and high sensitive less‐invasive wireless blood pressure sensor using MEMS technology

Modeling and thermal analysis of micro beam using COMSOL multiphysics

Investigation of on-chip integrated inductors fabricated in SOI-MUMPs for RF MEMS ICs

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