Positron Annihilation Spectroscopy (PAS) is a powerful probe to study open-volume defects in solids. Its su'ccess is due to the propensity of positrons to seek out low-density regions of a solid, such as vacancies and voids, and the emissions of gamma rays from their annihilations that carry information about the local electronic environment. The development of low-energy positron beams allows probing of defects to depths of few microns, and can successfully characterize defects in the near-surface and interface regions of several technologically important systems. This review focuses on recent studies conducted on semiconductor-based systems.
IntroductionThe last three decades saw an explosive growth in methods to produce materials with unique properties. Many of these techniques allowed the engineering of high-quality layered structures (both homo-and hetero-structures). Along with these advances, the need to characterize the defect content of these structures became evident. With many advanced materials, a single characterization method often is inadequate. Therefore, the material-research community has relied on a variety of techniques to control and optimize their processing steps. In this context, Positron Annihilation Spectroscopy (PAS) has become a powerful, nondestructive probe to characterize dilute quantities of open-volume defects.With the development of intense, variable-energy positron beams, it is possible now to examine defects in the near-surface regions and buried interfaces. Below, we describe the application of PAS to several advanced semiconductor-based systems, and include the following topics: defects in MBE-grown Si and GaAs, hydrogen interaction with Si dangling bonds, and electromigration-induced vacancy formation.