Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications

Noort, H.M. van; Kloos, Mario; Schäfer, Heiko

doi:10.1142/s0960313195000050

Cited by 5 publications

(2 citation statements)

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“…Two different substrate technologies were employed -printed AgPd thick film on alumina and conventional subtractive (chemically etched) PCB using 35mm (1oz) Cu clad FR5 laminate (with a submicron coating of Au on top of the Cu). The decision to use FR5 laminate was prompted by the reportedly poor performance of the more generally used FR4 laminates when used in ACA bonded assemblies (van Noort et al, 1994). FR5 has a higher Tg and is therefore much stiffer at the high process temperatures being used and also has a more uniform distribution of resin and reinforcement.…”

Section: Experimental Trialsmentioning

confidence: 99%

Anisotropic conducting adhesives for electronic assembly

Whalley

Mannan

Williams

1997

Assembly Automation

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Presents some experimental and theoretical results from research exploring the design rules and relevant process parameters in the assembly of electronic components using anisotropic conductive adhesive materials. The experimental configurations studies have geometries representative of flip‐chip and micro ball grid array chip scale packaging. Evaluates a range of materials combinations, including (random filled) adhesive materials based on both thermoplastic and thermo‐setting resin systems, combined with both glass reinforced polymer printed circuit board and silver palladium thick film on ceramic substrate materials. Also presents a summary of assembly experiments which have been conducted using a specially developed instrumented assembly system. This test rig allows the measurement of the process temperatures and pressures and their relationship with the consequent bondline thickness reduction and conductivity development. Finally summarizes the capabilities of models which have been developed of the assembly process and of the final joint properties.

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Section: Experimental Trialsmentioning

confidence: 99%

Anisotropic conducting adhesives for electronic assembly

Whalley

Mannan

Williams

1997

Assembly Automation

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“…Two different substrate technologies were employed-AgPd thick film on alumina and conventional PCB using 1 oz Cu clad FR5 laminate (with a sub-micron coating of Au on top of the Cu). The decision to use FR5 laminate was prompted by the reportedly poor performance of the more generally used FR4 laminates in ACA bonded assemblies [8]. FR5 is much stiffer at the high process temperatures being used and has a more uniform distribution 1083-4400/96$05.00 © 1996 IEEE of resin and reinforcement.…”

Section: A Materials Selection and Test Vehicle Designmentioning

confidence: 99%

Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: II. Theory

Ogunjimi

Mannan

Whalley

et al. 1996

IEEE Trans. Comp., Packag., Manufact. Technol. C

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This paper presents new results from an experimental and theoretical program to evaluate relevant process parameters in the assembly of a 500 m pitch area array component using anisotropic conductive adhesive (ACA) materials. This experimental configuration has features of micro ball grid array (BGA), chip scale packaging (CSP), and also flip-chip and conventional ball grid array (BGA) package structures. A range of materials combinations have been evaluated, including (random filled) adhesive materials based on both thermoplastic and thermosetting resin systems, combined with both organic and thick-film on ceramic substrate materials. The ACA's used have all been applied as films, and hence are also known as anisotropic conducting films (ACF). The test assemblies have been constructed using a specially developed instrumented assembly system which allows the measurement of the process temperatures and pressures and the consequent bondline thickness reduction and conductivity development. The effects of the process parameters on the resulting properties, particularly conductivity and yield, are reported. A complementary paper [1] indicates the results of computational fluid dynamics (CFD) models of the early stages of the assembly process which allow the extrapolation of the present results to finer pitch geometries.

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Erratum

1999

Microelectronics International

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Anisotropic Conductive Adhesives for Chip on Glass and Other Flip Chip Applications

Cited by 5 publications

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Anisotropic conducting adhesives for electronic assembly

Anisotropic conducting adhesives for electronic assembly

Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: II. Theory

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