Anisotropic etching of silicon in SF6 plasma

Knizikevičius, R.; Kopustinskas, V.

doi:10.1016/j.vacuum.2004.07.063

Cited by 16 publications

(10 citation statements)

References 12 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…One of the gases used to form these active plasma species is sulfur hexafluoride (SF 6 ), and the rapid and selective etching of silicon in pure sulfur hexafluoride and its mixtures with inert gases and molecular gases (O 2 , CF 4 , CHF 3 , …) has been demonstrated. [17][18][19][20][21][22][23][24][25][26][27] Si (100) surfaces can be textured using a mixture of SF 6 /O 2 as a result of the chemical reactivity of fluorine species and the significant role of SiOxFy masking species. 27 In a previous work, 28 we investigated the effect of the oxygen ratio in the SF 6 /O 2 plasma mixture on the formation of Si nanostructures, where we reported a low reflectance (0.01%), a defect-based "violet" PL from the obtained Si nanostructures, a fast response to humidity (1 s of time), and the spectral response of the formed nanostructures.…”

Section: Introductionmentioning

confidence: 99%

“…Plasma etching is used in the manufacture of semiconductor devices, 13–16 a process in which fluorine‐bearing radicals and ions form in the discharge plasma. One of the gases used to form these active plasma species is sulfur hexafluoride (SF 6 ), and the rapid and selective etching of silicon in pure sulfur hexafluoride and its mixtures with inert gases and molecular gases (O 2 , CF 4 , CHF 3 , …) has been demonstrated 17–27 …”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Study of silicon surface micro‐roughness generated by SF₆ remote plasma etching

Saloum

Zrir

Alkhaled

et al. 2023

Surface & Interface Analysis

View full text Add to dashboard Cite

We investigate micro-roughness of silicon surface in remote radiofrequency (RF) SF 6 plasma, for different etching durations. A linear behavior of etching rate is observed as a function of etching time. PL measurements at different temperatures indicate a visible (green and violet) and ultraviolet (UV) emissions. The evolution of surface roughness of Si substrates can be controlled depending on the etching duration.In response to the increase of the etching duration, the surface undergoes nanoscale roughening, ripple formation, and finally microscale roughening. Atomic force microscopy analysis was carried out to surface morphology.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Study of silicon surface micro‐roughness generated by SF₆ remote plasma etching

Saloum

Zrir

Alkhaled

et al. 2023

Surface & Interface Analysis

View full text Add to dashboard Cite

show abstract

“…As an alternative technique, there is the plasma cleaning technology, which has been the object of study of several works [2][3][4][5][6][7] and shown to be an efficient technique in degradation of compounds with different organic functions. Plasma cleaning technologies are already being used in the cleaning of inputs in the semiconductor sectors [8], food industry [9], medical [10,11], sputtering printed circuit boards [12], surface modification [13][14][15][16] and nitriding [17,18]. However, due to the complexity of the plasma environment, it is necessary to obtain more information about the influence of the different species on the degradation of organic functions [19].…”

mentioning

confidence: 99%

Influence of applied plasma power on degradation of L-proline in an inductively coupled RF plasma reactor

et al. 2022

View full text Add to dashboard Cite

Surface treatments such as heat treatments, paints, plasma treatments and galvanizing are important in metal working industry. In those treatments, the required adhesion characteristics can be limited if contaminants are present, so there is a need to clean these surfaces. Conventional processes can be costly, some generated waste may be environmentally hazardous and, in some cases, due to part geometry, they are not effective. Alternatively, plasma treatments which are considered to be environmentally clean, more efficient and with lower operating costs can overcome those difficulties. Due to the reactional complexity of these treatments, there are many fields to be researched, such as which reactions are due to impacts of (neutral) chemical species and which are due to excited species and radiation. The present work aims to verify the interactions between Ar-10%O 2 plasma using amino acid L-proline in an inductively coupled radiofrequency plasma. This study showed that oxidative plasma promotes high degradation of the sample. A gas analyzer (quadrupole mass spectrometer) coupled to the gas outlet was used and many gaseous products are detected during treatment, such: H 2 , H 2 O, CO, NO (Nitric Oxide) and CO 2 while L-proline undergoes intense degradation. The conclusions allow to state that the interaction between the Ar/O 2 plasma and L-proline promotes intense degradation through the breakdown of the heterocyclic ring of the molecule.

show abstract

“…A corrosão por plasma (SF6) [177] é uma técnica comumente usada em aplicações envolvendo estruturas com áreas relativamente grandes devido à alta taxa de corrosão do silício. No plasma SF6+O2 [174,178], ocorre competição entre os átomos de F e O pelos sítios ativos da superfície de Si, e a corrosão não ocorre pela remoção contínua da camada mais externa de Si, mas sim pela formação de uma fase intermediária bastante espessa e desordenada contendo as espécies SiF, SiF2, SiF3 e SiF4. A reação global deste processo pode ser descrita pela equação a seguir:…”

Section: Determinação Do Ph Em Intestino Médio De Lepidópterasunclassified

“…Por fim, uma modificação também foi realizada no procedimento de corrosão da placa de Si, empregando-se corrosão por PCE (plasma chemical etching [178]) usando plasma de SF6. Esta é uma metodologia bastante utilizada para a obtenção estruturas MEMS devido à sua alta taxa de corrosão do silício.…”

unclassified

Desenvolvimento de microssensores eletroquímicos para aplicações em estudos envolvendo amostras de interesse biológico utilizando a microscopia eletroquímica de varredura

Selva¹

View full text Add to dashboard Cite

This thesis presents some approaches to manufacturing miniaturized electrochemical sensors aiming at applications in biological samples. Potentiometric pH sensors were fabricated from IrOx films using two different strategies. In the first one, the device was manufactured in a micropipette and was applied in SECM studies involving the pH determination of some biological samples. These devices showed a super-Nernstian and stable response, even in complex samples. Thus, it was found that adjacent regions of C2C12 cells undergo a pH decrease after stimulation with caffeine.In another study, significant pH changes were noticed in the midgut of some lepidopteran order larvae throughout their developmental stages. However, in general, the medium tends to remain alkaline. The second approach involved the development of Si microneedles using MEMS technology. These devices were also surface-modified with a pH-sensitive IrOx film. The geometry and mechanical stability of the microneedles make these devices very promising for in vivo application studies. A Ca 2+ ion-selective membrane electrode was fabricated in a micropipette and used to assess the Ca 2+ permeation through alginate/gelatin hydrogels. It was found that the presence of magnetic nanoparticles in the hydrogel composition increases the permeation of Ca 2+ , while caffeine has the opposite effect, but to a minor extent. Finally, the SECM technique was used to evaluate the electrocatalytic properties of nanostructured materials. In the first study, a nanoporous gold microelectrode was used to map the dopamine diffusion, simulating its release by a cell. In the last two studies, kinetic parameters of these surfaces´ reactivity were obtained by approach curves, and the catalytic activity promoted by these surfaces was confirmed.

show abstract

Anisotropic etching of silicon in SF6 plasma

Cited by 16 publications

References 12 publications

Study of silicon surface micro‐roughness generated by SF₆ remote plasma etching

Study of silicon surface micro‐roughness generated by SF₆ remote plasma etching

Influence of applied plasma power on degradation of L-proline in an inductively coupled RF plasma reactor

Desenvolvimento de microssensores eletroquímicos para aplicações em estudos envolvendo amostras de interesse biológico utilizando a microscopia eletroquímica de varredura

Contact Info

Product

Resources

About

Anisotropic etching of silicon in SF6 plasma

Cited by 16 publications

References 12 publications

Study of silicon surface micro‐roughness generated by SF6 remote plasma etching

Study of silicon surface micro‐roughness generated by SF6 remote plasma etching

Influence of applied plasma power on degradation of L-proline in an inductively coupled RF plasma reactor

Desenvolvimento de microssensores eletroquímicos para aplicações em estudos envolvendo amostras de interesse biológico utilizando a microscopia eletroquímica de varredura

Contact Info

Product

Resources

About

Study of silicon surface micro‐roughness generated by SF₆ remote plasma etching

Study of silicon surface micro‐roughness generated by SF₆ remote plasma etching