We deposited pure m-plane GaN (1-100) layers on LiAlO 2 (100) substrates by MOVPE using Mg-doped InGaN buffer layers of various thickness. These sealing layers are grown under nitrogen ambient and help to improve the film coalescence while reducing the oxygen background doping of the GaN films. We show that for an increasing thickness of the InGaN:Mg buffer layer, the highly strained GaN layer slightly relaxes. An improved surface morphology can be achieved for thicker InGaN:Mg buffers while the defect density clearly increases above a certain thickness as it can be seen in X-ray rocking curve measurements. In temperature-dependent photoluminescence spectroscopy, we observe not only peaks due to DAP transitions at an energy of around 3.3 eV, but also a defect related peak at 3.43 eV as well as a peak at 3.49 eV connected to free and bound excitonic transitions. It is interesting to note that for an increasing thickness of the InGaN:Mg buffer, we detect a higher intensity of the excitonic transition while the defect-related signal seen at 3.43 eV is getting more pronounced. It might be possible that during the film relaxation, basal plane stacking faults are introduced into the layer.
IntroductionThe increasing demand for highly efficient nitride blue and green light emitting diodes (LEDs) has attracted great interest for the growth of nonpolar GaN. In contrast to the common growth of nitride material in the polar c-axis, the absence of polarization-induced electric fields in the growth direction for nonpolar structures leads to a better overlap of electron and hole wave functions in quantum wells and therefore to a more efficient carrier recombination [1]. As a second advantage, nonpolar light emitters exhibit a much lower wavelength shift with higher driving currents due to the absence of polarization field screening normally occurring in c-plane GaN [2]. One interesting approach to achieve this is to grow on (100) LiAlO 2 substrates, which enables a deposition of GaN in m-plane orientation with a rather small substrate-lattice mismatch of only 1.7 % and 0.3 % in [11][12][13][14][15][16][17][18][19][20] and [0001] direction of GaN, respectively [3]. The substrates can be manufactured by conventional Czochralski pulling method which allows potentially cheap large-size wafer production. One of the challenges with this material is the sensitivity to hydrogen and water. On the other hand, this offers a possibility of an easy substrate removal after device processing for an improved light extraction and heat management. In first literature reports, mainly molecular beam epitaxy (MBE) was used to deposit pure m-plane GaN on LiAlO 2 [1,3,4] but also successful growth by hydride vapor phase epitaxy (HVPE) has been reported [5]. The challenges with the growth by metal organic vapor phase epitaxy (MOVPE) on this substrate are related to the demand for high growth temperatures and hydrogen ambient to achieve high-quality material, both of which can cause serious substrate damage. Nevertheless, several groups succeeded in...