Anodic oxidation of copper in alkaline solutions

Shoesmith, D.W.; Sunder, S.; Bailey, M. G.; Wallace, Gordon G.; Stanchell, F.W.

doi:10.1016/s0022-0728(83)80261-7

Cited by 81 publications

(50 citation statements)

References 35 publications

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“…Whatever be the mechanism of oxidation, the final products on the electrode are likely to be CuO and Cu(OH) 2 . But a study by Shoesmith et al 17 using X-ray Photoelectron Spectroscopic (XPS) technique and Brisard et al 18 using Probe Beam Deflection (PBD) method concluded that Cu 2 O is also present in the oxide film produced on the copper along with other oxides and hydroxides. This suggest that, Cu 2 O produced on the copper surface does not react completely as per reactions 9 and 11 to produce Cu(OH) 2 and CuO.…”

Section: Cu(o H)mentioning

confidence: 99%

Electrochemical Study of Bulk and Monolayer Copper in Alkaline Solution

Giri

Sarkar

2016

J. Electrochem. Soc.

171

110

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The formation of copper oxides and hydroxides from metallic copper and underpotentially deposited copper atoms on platinum nanoparticles, when it is subjected to a potential scan between the hydrogen evolution potential and the oxygen evolution potential in alkaline solution as a function of scan rate and the pH of the solution has been investigated. Cyclic voltammetry of bulk copper electrodes in alkaline solution reveal that oxidation proceeds in steps leading to formation of Cu 2 O, Cu(OH) 2 and CuO on the surface as well as some soluble oxides which corroborates well with X-ray photoelectron spectroscopy (XPS) analysis. Furthermore, interesting needle like formations on copper surface was observed in a scanning electron microscope (SEM), which can explain the unusual relation between the peak current and scan rate. On the other hand, the oxidation of copper monolayer on platinum nanoparticles leads primarily to formation of Cu 2 O and shows the effect of nobility imparted by the underlying platinum in terms of increased potential.

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Section: Cu(o H)mentioning

confidence: 99%

Electrochemical Study of Bulk and Monolayer Copper in Alkaline Solution

Giri

Sarkar

2016

J. Electrochem. Soc.

171

110

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“…It is apparent from this that increasing the amount of Ag in the plating solution increases the intensity of the XRD peaks for Ag, particularly the Ag(111) peak. The particle size, as measured from the SEM images, also gener- 26,27) This incomplete plating of Ag can be explained by inadequate galvanic displacement caused by using an insuf cient amount of Ag in the solution. Increasing the Ag content of the precursor solution reduces the non-plated area on the surface of the Cu particles, which is why holes were scarcely observed on particles plated with solutions containing more than 3.75 mass% Ag.…”

Section: Resultsmentioning

confidence: 99%

Resistance to Oxidation at 150℃ of Sub-Micrometer Diameter Silver-Coated Copper Particles Produced by Wet Chemical Synthesis and Immersion Plating

Shin

Lee

2017

Mater. Trans.

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Sub-micrometer diameter Cu particles fabricated in air by wet synthesis at 80 C for 2 h were immersion plated with Ag to produce an inexpensive conductive paste ller aimed at achieving ne printed patterns. Increasing the volume ratio of hydrazine hydrate to ammonium hydroxide used during wet synthesis was found to accelerate the rate of reduction and increase the yield of Cu particles to as much as 97.56% when an optimal ratio of 3:7 was used. The resulting particles (average size = 0.56 μm) exhibited excellent dispersion, with the use of an optimal Ag concentration of 15 mass% in their subsequent immersion plating producing a continuous Ag shell and a 0.62 μm average diameter. Increasing the Ag concentration beyond this, however, resulted in abrupt agglomeration between the particles, as well as the formation of cavities and spherical pure Ag particles. Those particles produced under optimal conditions experienced only a slight weight increase of 0.4% after 75 min exposure to air at 150 C, suggesting that they have an excellent resistance to oxidation at this temperature.

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“…The cupric hydroxide, Cu(OH) 2 filling the pores and overlaying Cu 2 O was converted to CuO since the latter is thermodynamically stable [13]. On further going to a more positive potential value the anodic peak A 9 appeared as a result of the conversion of the sulphide ions to sulphate soluble compounds [10].…”

Section: Resultsmentioning

confidence: 99%

Effect of Addition of Sulphide Ions on the Electrochemical Behaviour and Corrosion of Cu-Ag Alloys in Alkaline Solutions

2006

Int J Electrochem Sci

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The electrochemical behaviour of copper-silver alloys was studied in 0.5 M NaOH containing sulphide ions using cyclic voltammetric and potentiodynamic anodic polarization techniques between the hydrogen and the oxygen evolution reactions under the effect of different variables such as reversal potential, scan rate, sulphide ion concentration, temperature and number of repeated cycles. The anodic sweep of potential was characterized by the appearance of three potential regions: sulphide attack potential region, copper dissolution potential region and silver dissolution potential region, prior to the oxygen evolution reaction. The first potential region was characterized by the appearance of three anodic peaks A 1 , A 2 and A 3 , which were related to the formation of Cu x S, Ag 2 S and sulphur on the electrode surface. The formation of Cu x S and Ag 2 S was associated with the formation of pits on the electrode surface. Scanning electron microscope was used to examine the electrode surface for pitting corrosion. In the copper dissolution potential region, copper dissolved selectively that was associated with the appearance of three anodic peaks A 4 , A 5 and A 6 , which are related to the formation of Cu 2 O, Cu(OH) 2 and CuO, respectively. In the third potential region, silver dissolves, which was associated with the appearance of two anodic peaks A 8 and A 9 , which were related to the formation of Ag 2 O and both of Ag 2 O 2 and soluble SO 4 2¯ compounds, respectively. X-ray diffraction analysis confirmed the existence of Ag 2 S, Cu x S, Ag 2 O and CuO on alloy I potentiodynamically polarized to 400 mV. The reverse sweep was characterized by the appearance of one activation peak A 10 and eight cathodic peaks

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Anodic oxidation of copper in alkaline solutions

Cited by 81 publications

References 35 publications

Electrochemical Study of Bulk and Monolayer Copper in Alkaline Solution

Electrochemical Study of Bulk and Monolayer Copper in Alkaline Solution

Resistance to Oxidation at 150℃ of Sub-Micrometer Diameter Silver-Coated Copper Particles Produced by Wet Chemical Synthesis and Immersion Plating

Effect of Addition of Sulphide Ions on the Electrochemical Behaviour and Corrosion of Cu-Ag Alloys in Alkaline Solutions

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