Anodised Aluminium as an Alternative Substrate for High Power Hybrid Microelectronics

Brakspear, Stephen

doi:10.1108/eb044407

Microelectronics International

1990

DOI: 10.1108/eb044407

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Anodised Aluminium as an Alternative Substrate for High Power Hybrid Microelectronics

Stephen Brakspear

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Cited by 1 publication

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Thermally Conductive Circuit Board Using Anodized Aluminum And Polymer Thick Film

Takeda¹,

Uematsu²

Proceedings of Japan International Electronic Manufacturing Technology Symposium

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This paper describes newly developed thermally conductive circuit board. The board consists of an anodized aluminum substrate, which is coated with electrodeposited acrylic-melamine polymer.Both anodized aluminum and electrodeposited polymer work as insulating layers between aluminum core and electrical circuitry. Polymer thick film (PTF) is adopted as circuitization in the board. This paper describes manufacturing process and evaluation results of the board from the viewpoint of both electrical and thermal reliability. Two of prototype models for power application are demonstrated in this paper.

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Thermally Conductive Circuit Board Using Anodized Aluminum And Polymer Thick Film

Takeda¹,

Uematsu²

Proceedings of Japan International Electronic Manufacturing Technology Symposium

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Anodised Aluminium as an Alternative Substrate for High Power Hybrid Microelectronics

Cited by 1 publication

References 6 publications

Thermally Conductive Circuit Board Using Anodized Aluminum And Polymer Thick Film

Thermally Conductive Circuit Board Using Anodized Aluminum And Polymer Thick Film

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