Metal oxide thin films for soft and flexible electronics require low cost, room temperature fabrication, and structuring processes. We here introduce an anodic printing process to realize the essential building blocks of electronic circuitry, including resistors, capacitors, field-effect transistors, diodes, rectifiers, and memristors directly on imperceptible plastic substrates. Largely independent on surface properties, we achieve high-quality, few nanometer thin dielectric and semiconducting films even on rough substrates via localized anodisation of valve metals using a scanning droplet cell microscope. We demonstrate printing-like fabrication of 3D multilayer solid-state capacitors with a record-high areal capacity of 4 µF cm −2 . Applicable to the whole class of valve metals and their alloys, our method provides a versatile fabrication technique for the circuits that empower the flexible and stretchable electronics of tomorrow.