2013
DOI: 10.1017/s1759078712000815
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Antenna-in-package (AiP) in mm-wave band

Abstract: We studied the viability of the embedded wafer level ball grid array (eWLB) package environment as an antenna platform for 77 GHz automotive radar sensors and the effects of package fabrication tolerances on the antenna performance. The investigation of different antenna concepts in the eWLB package and their characterization methods are addressed. The design procedures for electrically large, differentially fed loop antennas in a multilayer package structure are introduced. Two different planar antennas are d… Show more

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Cited by 4 publications
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