Antenna-Integrated, Die-Embedded Glass Package for 6G Wireless Applications

Jia, Xiaofan; Li, Xingchen; Moon, Kyoung-Sik; Kim, Joon‐Woo; Huang, Kai-Qi; Jordan, Matthew B.; Swaminathan, Madhavan

doi:10.1109/ectc51906.2022.00069

Cited by 11 publications

(4 citation statements)

References 9 publications

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“…Current research indicates that this die-embedded glass package technology may also be suitable for future 6G wireless communications at D-band [87], [88]. An example of a sub-THz glass-polymer package with integrated antennas and microvia chip-to-package interconnects is shown in Fig.…”

Section: Packaging and Interposer Solutionsmentioning

confidence: 99%

“…This includes chip-to package microvia transitions (see Fig. 7(f)) which land from the thin build-up layers directly onto the chip pads [85], [86], [19], [81], [88]. Via-in-via through package interconnects [26], [80], [81] and microviaenhanced organic RDLs on glass core substrates [114], [115], [116] were also reported for future HPC and wireless communications systems.…”

Section: Components a Transmssion Lines And Interconnectsmentioning

confidence: 99%

See 1 more Smart Citation

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

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Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems with high-bandwidth I/Os have become a mainstream solution to address multi Gbit/s data rates. Heterogeneous integration technologies play a vital role here in enhancing the performance and functional density, along with reducing the size and costs of such RF systems. In line with this trend, many passive components, which have once been monolithically integrated, are now implemented on ceramic or polymer-based packages. Besides these long-established material and process technologies, considerable efforts have also recently been devoted to the development of RF components on glass and glass-ceramics. Spurred by their low dielectric losses, extremely smooth surfaces, and excellent dimensional stability, glass technologies are emerging as a promising alternative for high-volume and high-performance RF applications. In this article, relevant glass materials and key enabling technologies are reviewed and put into context with well-established RF substrate technologies. Another focus is set on the latest glass-based packaging and interposer solutions ranging from MHz-to-THz frequencies. To showcase the development activities and practical accomplishments of the RF glass technology, also a large variety of key components is presented. Finally, the paper concludes by discussing future research and development directions of RF glass devices.INDEX TERMS MTT 70th Anniversary Special Issue, glass technology, dielectrics, packaging, interposer, system-on-package, interconnects, filters, antennas, antenna-in-package, millimeter wave (mm-wave).

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Section: Packaging and Interposer Solutionsmentioning

confidence: 99%

Section: Components a Transmssion Lines And Interconnectsmentioning

confidence: 99%

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

View full text Add to dashboard Cite

show abstract

“…This study addresses these limitations by presenting the thermal isolation performance of PI aerogels within a real chip configuration and providing guidance on their integration based on the investigation of the impact of various parameters on thermal isolation efficacy. Specifically, we implemented a die-embedded glass interposer − as an example. The die-embedded glass interposer contains dielectric material that serves as thermal and electrical insulation, and we compare the thermal isolation effect between epoxy, a traditional dielectric material, and PI aerogel when they are used as dielectric layers.…”

Section: Introductionmentioning

confidence: 99%

Thermal Isolation Performance of Polyimide Aerogel within a Die-Embedded Glass Interposer

Kim,

Ma,

Tian

2024

ACS Appl. Eng. Mater.

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With the continuous miniaturization of microelectronics, the need to effectively prevent thermal crosstalk between adjacent functional blocks is increasing. This study focuses on mitigating thermal crosstalk between high-and low-power components within the die-embedded glass interposer by incorporating a thermal isolation material�polyimide (PI) aerogels. Polyimide aerogels possess ultralow thermal conductivity of 0.029 W/(m K), low dielectric constant in the range of 1−3, and hightemperature stability up to 400 °C, which makes them an ideal candidate for a thermal isolation material. Given the complexity of the actual configurations, we leverage simulations to evaluate the isolation performance in this initial study. We first conducted infrared (IR) camera measurements on a simplified test setup to validate the thermal model. The results confirm the superior thermal isolation performance of PI aerogels, thereby demonstrating their potential as highly effective thermal isolation materials for microelectronic applications.

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“…When considering commercial applications, high performance and compact size are typically needed, though these may sometimes be contradictory requirements. Achieving the compactness requires a high degree of integration, which increases the significance of packaging and the materials used [8], [9]. Highly integrated systems also affect the measurement aspects, as it reduces the number of interfaces to test particular components or subsystems compared to earlier generations of devices.…”

Section: Introductionmentioning

confidence: 99%

OTA Measurement Technique for Sub-THz Integrated Lens Antennas

Rasilainen

Leinonen

Nokandi

et al. 2023

2023 100th ARFTG Microwave Measurement Conference (ARFTG)

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Moving to sub-THz frequencies introduces new challenges for wireless communications systems in terms of design, implementation, and testing. This paper presents a measurement technique for over-the-air (OTA) characterisation of sub-THz antennas at WR3.4 band (220-330 GHz), and a silicon (Si) lens fed by an on-chip antenna is used as a test vehicle. In the proposed measurement technique, the received sub-THz AM-modulated test signal is downconverted to kHz-range using a square-law power detector. Measurements and simulations/calculations are used to compare several key antenna/link parameters. Agreement between the results is good, which shows that the proposed technique provides a good and less hardware-intensive alternative for sub-THz antenna measurements.

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Antenna-Integrated, Die-Embedded Glass Package for 6G Wireless Applications

Cited by 11 publications

References 9 publications

RF Glass Technology Is Going Mainstream: Review and Future Applications

RF Glass Technology Is Going Mainstream: Review and Future Applications

Thermal Isolation Performance of Polyimide Aerogel within a Die-Embedded Glass Interposer

OTA Measurement Technique for Sub-THz Integrated Lens Antennas

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