2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) 2013 Help me understand this report
Anti-resonance peak frequency control by variable on-die capacitance
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“…Especially, chip-package anti-resonance in the power distribution network (PDN) occurs due to the parallel combination of on-die capacitance and package inductance. In order to estimate the peak frequency and peak level of anti-resonance exactly, on-die PDN impedance must be properly designed along with package, and board PDN design [3]- [5].…”
Section: Introductionmentioning
confidence: 99%
“…Especially, chip-package anti-resonance in the power distribution network (PDN) occurs due to the parallel combination of on-die capacitance and package inductance. In order to estimate the peak frequency and peak level of anti-resonance exactly, on-die PDN impedance must be properly designed along with package, and board PDN design [3]- [5].…”
Section: Introductionmentioning
confidence: 99%
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