Aperture coupling versus connectors for the transition between T/R-modules and radiators in large phased arrays

Loffler, D.; Gschwendtner, Edda; Wiesbeck, W.

doi:10.1109/aps.1999.789381

Cited by 1 publication

(1 citation statement)

References 4 publications

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“…Because a via-hole transition has the characteristic of a low pass filter, design for high frequency is limited. Aperturecoupled transition [6,7] can change the shape of an aperture or a microstrip terminal and obtain improved bandwidth, but it cannot be used as an appropriate design method. Finally, cavity-coupled transitions [8,9] have been presented to transfer signals through several layers with a relatively narrower bandwidth.…”

Section: Introductionmentioning

confidence: 99%

Compact Multilayer Hybrid Coupler Based on Size Reduction Methods

Kim¹,

Yoon²

2015

PIER Letters

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Abstract-This paper presents a compact multilayer hybrid coupler based on a microstrip viatransition and short transmission line with a capacitor on each side to reduce circuit size. The microstrip via-transition is connected to two microstrip lines in different layers to configure a sandwich structure. To reduce the passive component circuit size, the design method uses a microstrip via-transition and a short transmission line with capacitors on each side. To validate the microstrip via-transition and short transmission line with capacitor, a multilayer hybrid coupler is implemented at a center frequency of 2 GHz. The measured characteristics agreed well with the simulation results, and above 90% circuit-size reduction compared with conventional couplers was realized.

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