Apparatus to measure high-temperature thermal conductivity and thermoelectric power of small specimens

Abstract

A thermal conductivity apparatus based on the parallel heat-flow technique has been fabricated to measure the thermal conductivity of small specimens. The steady-state method is used to measure samples of 1 ϫ 1 ϫ 10 mm 3 dimension in the temperature range of room temperature-700 K. The details of instrument fabrication, the method of calibration, and typical measurements on test samples are described. The apparatus can also be used to measure the Seebeck coefficient in the same temperature range. As an example we report the thermal properties of CrSi 2 , which is a potential candidate for high-temperature thermoelectric applications.

A novel method to control oxygen stoichiometry and thermoelectric properties in (RE)BaCo2O5+δ

“…The sheet resistance values were measured by making spring loaded platinum contacts and the resistivity values calculated using an efficient algorithm (Chan 2000). The Seebeck coefficient was also measured on a home built setup (Dasgupta and Umarji 2005). The values were measured with respect to copper.…”

Thermal properties of MoSi2 with minor aluminum substitutions

“…Room temperature thermal conductivity measurements were carried out using a home built apparatus based on the parallel conductance technique [22] adopted by us for bulk samples [23]. A steady state DT between a heat source copper block and heat sink was established with the sample (w1 mm 2 and w10 mm length) acting as a parallel thermal link.…”

Methods and Apparatus for Measuring Thermopower and Electrical Conductivity of Thermoelectric Materials at High Temperatures

“…[43], stationary method of measuring thermal conductivity and differential method of thermopower measurement are used. Measurement of thermal conductivity is based on the comparison between temperature difference of heat source and heat sink in the presence of the sample and without the sample.…”