Applicability of Different Bio-based Polymers for Wiring Boards

Henning, C.A.O.; Schmid, Anna; Hecht, Sophia; Harre, Kathrin; Bauer, Rudolf

doi:10.3311/ppee.13431

Cited by 15 publications

(7 citation statements)

References 15 publications

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“…It is concluded that most of the presented PCB substrate materials can be used in explicit reflow profile modelling later, with negligible error caused by the uneven temperature along the thickness of the board; however PLA shows more considerable temperature differences (<20 per cent compared to the full temperature scale) pointing to larger model imprecision. Finally, the use of PLA substrates results in more significant temperature differences along the bulk thickness of the applied board, which further complicates the use of such thermally sensitive materials (Henning et al , 2019) in assembly.…”

Section: Discussionmentioning

confidence: 99%

“…In this paper the following PCB types and materials were investigated: FR4 (epoxy with glass fibre reinforcement, handled as a composite in our calculations), Polyimide [commonly used for flexible boards (Fjelstad, 2011)], BeO and Al 2 O 3 [used in technical ceramic-based circuits in microwave and power electronics applications (Licari and Enlow, 1998)] and biodegradables, such as PLA (polylactic-acid) and CA (cellulose acetate) [under intensive research for use in electronics (Schramm et al , 2012; Henning et al , 2019; Zhang et al , 2019)]. Table I.…”

Section: Methodsmentioning

confidence: 99%

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Modelling of temperature distribution along PCB thickness in different substrates during reflow

Straubinger

Bozsóki

Busek

et al. 2019

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Purpose In this paper, analytical modelling of heat distribution along the thickness of different printed circuit board (PCB) substrates is presented according to the 1 D heat transient conduction problem. This paper aims to reveal differences between the substrates and the geometry configurations and elaborate on further application of explicit modelling. Design/methodology/approach Different substrates were considered: classic FR4 and polyimide, ceramics (BeO, Al2O3) and novel biodegradables (polylactic-acid [PLA] and cellulose acetate [CA]). The board thicknesses were given in 0.25 mm steps. Results are calculated for heat transfer coefficients of convection and vapour phase (condensation) soldering. Even heat transfer is assumed on both PCB sides. Findings It was found that temperature distributions along PCB thicknesses are mostly negligible from solder joint formation aspects, and most of the materials can be used in explicit reflow profile modelling. However PLA shows significant temperature differences, pointing to possible modelling imprecisions. It was also shown, that while the difference between midplane and surface temperatures mainly depend on thermal diffusivity, the time to reach solder alloy melting point on the surface depends on volumetric heat capacity. Originality/value Results validate the applicability of explicit heat transfer modelling of PCBs during reflow for different heat transfer methods. The results can be incorporated into more complex simulations and profile predicting algorithms for industrial ovens controlled in the wake of Industry 4.0 directives for better temperature control and ultimately higher soldering quality.

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Section: Discussionmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Modelling of temperature distribution along PCB thickness in different substrates during reflow

Straubinger

Bozsóki

Busek

et al. 2019

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“…According to the type of the fitted function it can be categorized as a linear and non-linear optimization task. The literature contains a lot of different methods to solve this problem with the required accuracy [15][16][17][18][19][20][21][22][23][24][25][26]. Most of these measurements use the gradient-based solvers, the Gauss-Newton Algorithm or the Levenberg-Marquardt Algorithm, which use the fact that these problems can be expressed by the rules of the Quadratic Programming (QP) [27,28].…”

Section: Nonlinear Curve Fitting With āRtapmentioning

confidence: 99%

Parameterization of Debye Model for Dielectrics Using Voltage Response Measurements and a Benchmark Problem

Mustafa

Németh

Afia

et al. 2021

Period. Polytech. Elec. Eng. Comp. Sci.

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The Voltage Response measurement since its introduction in the 1960s has been used successfully for the diagnostics of electrical insulation. The method is based on two quantities of decay and return voltage slopes and can be used to study the conduction and polarization processes inside the insulation. Extended Voltage Response method, being an advanced version of the Voltage Response measurement helps in further studying the polarization process by using a large polarization spectrum and hence dielectric relaxation processes. These dielectric relaxation processes can be modeled by the Debye model. Since as most of the techniques used for diagnostic purpose does not give the information about the conduction and polarization processes separately, it is difficult to determine the R-C parameters of the Debye model. The Voltage Response technique is very useful in this regard because of the two voltage slopes. The paper shows a novel experimental benchmark for testing the function fitting methodologies of the Voltage Response methodologies, which helps in determining the R-C parameters. Moreover, the problem can be used for testing the novel genetic, evolutionary algorithms, where benchmarking is an actual challenge. The proposed nonlinear function fitting method uses the genetic algorithms via the Ārtap framework, which lets it possible to select the most accurate optimization algorithm from the provided list of the algorithms and achieve better fitting precision, faster calculation time or more powerful processing ability.

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“…The proposed method and setup is especially useful for special applications, such as pin in paste technology [14], or soldering on special, heat sensitive materials, such as biodegradables [15,16], which is a special current and future application of the presented solution.…”

Section: Introductionmentioning

confidence: 99%

Refined Approach on Controlling Heat Transfer in a Vapour Phase Soldering Oven

Géczy

Kiss

Alaya

et al. 2019

2019 42nd International Spring Seminar on Electronics Technology (ISSE)

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The control of soldering temperature profiles is crucial in any reflow process of electronic assemblies. In our paper a novel approach is presented on the control of the temperature during vapour phase soldering process. In the given case the electronic surface mounted assembly to be soldered is immersed into the vapour with a special sample holder system and moved up and down by a flexible LabVIEW hardware and software configuration. It was found that with proper data acquisition and appropriate programming, the system is able to follow pre-programmed soldering profiles with small deviation. The paper presents the system, the experimental configuration and initial results obtained with the setup. The proposed setup can improve the current view on proper heat transfer handling in VPS ovens, and also enables precise control on investigations with different low-temperature solder alloys, and most importantly, thermally sensitive substrates, such as biodegradable epoxies, or moulded interconnect devices.

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Applicability of Different Bio-based Polymers for Wiring Boards

Cited by 15 publications

References 15 publications

Modelling of temperature distribution along PCB thickness in different substrates during reflow

Modelling of temperature distribution along PCB thickness in different substrates during reflow

Parameterization of Debye Model for Dielectrics Using Voltage Response Measurements and a Benchmark Problem

Refined Approach on Controlling Heat Transfer in a Vapour Phase Soldering Oven

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