Application of a three-dimensional surface analysis system to the prediction of asperity interaction in metallic contacts

Sullivan, Paul; Poroshin, V. V.; Hooke, C. J.

doi:10.1016/0890-6955(92)90074-q

Cited by 4 publications

(2 citation statements)

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“…There are numerous texts outlining the technique and consequently the subject not be dealt with here in great detail. Though an excellent tool the AFM suffers some major drawbacks, firstly the systems suffer from limited measuring area, commercially the maximum available being 200 x 200 µm 2 . Whilst this appears large to the nanotechnologist, to the engineer making large wafers the lateral measurement range is orders of magnitude too small.…”

Section: Instrumentationmentioning

confidence: 99%

“…In a generic engineering sense these surfaces are termed "functional surfaces". The relationship between surface topography and the functional surface has only been partially investigated and most work that has been conducted in this area was undertaken using 2D surface analysis [1,2], that is through the use of profile analysis. Recent advances in surface measurement and characterisation in 3D however have led to furious activity in the correlation of surface topography and surface function.…”

Section: Surface Creationmentioning

confidence: 99%

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The use of advanced 3D surface metrology for the characterisation of epi‐wafers and Si structures

Blunt

Armstrong²,

Blunt

2005

phys. stat. sol. (c)

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PACS 68.35.-p, 68.37.-d, 68.55.-a Over recent years the discipline of surface metrology has advanced greatly both in terms of instrumentation and in terms of techniques for surface characterisation. The advances in instrumentation have entailed the introduction, as an industrial tool, of the atomic force microscope and the widespread use of optical interferometry. Both of these techniques have allowed visualisation of the 3D surface texture of epi-wafers at the micro and nanometer scale. The clear advantage of interferometry is that it is contactless and fast whereas the AFM technique, although it has a better measurement resolution, is still contacting the surface even in tapping mode and could potentially damage or contaminate the surface. A drawback common to both of these instrument types is that despite the "richness" of the data collected it is usually only the average roughness R a , root mean square roughness R q or maximum peak to valley roughness R t , values of the surface texture that are quoted. True surface areal texture information cannot be described by such parameters. Consequently these simple amplitude based roughness parameters are inadequate for describing anything more than very simple epi-structures and as a result differing textures can often yield similar roughness values. This paper outlines the recent advances in 3D surface characterisation and applies this to epi-wafer surface topography. Surface creationSurfaces are created by a large variety of manufacturing processes and each manufacturing technique leaves its own fingerprint on the surface produced. Sometimes the fingerprint from a surface can produce a beneficial effect on the character of the surface but on other occasions the resulting surface can deleteriously affect the ability of the workpiece to perform its intended function. It is therefore important that the "3D fingerprint" which is produced as a result of any surface manufacturing method be understood in terms of its effect on the function for which the surface is intended. If the general nature of the surface is deemed unacceptable then a surface modification technique is undertaken to modify its suitability for the intended function or the workpiece is scrapped. In many cases it is not the inherent nature of the manufacturing process that is at fault but the manufacturing conditions under which the surface has been finished. As a consequence modifying the parameters of the final process may yield a satisfactory result. This implies that the engineer must improve his understanding of surface production methods and the effects that these production methods may have on the functional properties of the surface.Many surfaces are designed to possess specific properties such as epi layers or even MEMs structures. In a generic engineering sense these surfaces are termed "functional surfaces". The relationship between

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Section: Instrumentationmentioning

confidence: 99%

Section: Surface Creationmentioning

confidence: 99%