Application of Commercial Finite Element Codes for the Analysis of Induced Strain-Actuated Structures

Lin, Mark W.; Abatan, Ayo O.; Rogers, Craig A.

doi:10.1177/1045389x9400500621

Cited by 34 publications

(20 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In recent years, the piezoelectric material elements, having realized electromechanical coupling in some commercialized finite element software packages, such as ANSYS, ABAQUS, and ATILA, provide linear coupling element. Lin et al (1994) analyzed the piezoelectric material elements in commercial finite element software and compared the solving abilities of the two main software packages ANSYS and ABAQUS. Scientific researchers are investigating the defects and cracks of piezoelectric materials, nonlinear electromechanical coupling, etc., by means of numerical calculation.…”

Section: Chapter 13 Numerical Methods For Analyzing Fracture Of Piezoementioning

confidence: 99%

Fracture Mechanics of Piezoelectric and Ferroelectric Solids

Fang¹,

Liu²

2013

View full text Add to dashboard Cite

Section: Chapter 13 Numerical Methods For Analyzing Fracture Of Piezoementioning

confidence: 99%

Fracture Mechanics of Piezoelectric and Ferroelectric Solids

Fang¹,

Liu²

2013

View full text Add to dashboard Cite

“…Finite element analysis (FEA) has been extensively employed to perform the stress analysis in thin films in the literature. 17,18,32 FEA is a powerful numerical modeling tool that can simulate stress and deformation in wide range of materials of various shapes. Analytical modeling is quite challenging for films of nonuniform microstructure.…”

Section: Modelingmentioning

confidence: 99%

Residual stress modeling of density modulated silicon thin films using finite element analysis

Citirik¹,

Demirkan

Karabacak

2014

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

View full text Add to dashboard Cite

Density modulated thin films offer a compliant property that can reduce residual stress, which typically originate during the growth of thin films. Lower residual stress improves adhesion properties of the film with reduced buckling or delamination, and therefore leads to more durable coatings. In this study, finite element analysis (FEA) was employed to simulate the residual stresses developed in density modulated silicon (Si) thin films, which incorporate alternating low and high density layers. The main focus of this investigation is not developing new FEA algorithms but to verify the impact of density modulated layers quantitatively using computational methods. Hence, verification of a predicted stress reduction enhances the current understanding of the mechanics of density modulated layered thin films. FEA simulation results reveal that low density layers act compliant and result in significant reduction in film stress especially at the interface with the substrate. For example, maximum stress at the film/substrate interface, which is in the substrate, was reduced from 2897 MPa down to 2432 MPa by simply adding a 100 nm thick densitymodulated low-density Si layer in between a 300 lm thick Si wafer substrate and 1 lm thick conventional high density Si film, which makes the reduction percentage of the maximum stress about 16%. V

show abstract

“…There are two methods of modeling and analysis which can be used to simulate and model piezoelectric USM's [23][24][25][26]. These methods are the analytical analysis and finite element analysis (FEA) method [23][24][25][26].…”

Section: Usm Modeling and Analysis Using Finite Element Analysismentioning

confidence: 99%

A Piezoelectric Servo Feed Drive for Electro Discharge Machining System Industrial Applications Using Linear Ultrasonic Motor

Shafik

Abdalla

Fransson

2013

Journal of Manufacturing Science and Engineering

View full text Add to dashboard Cite

A new servo drive for electro discharge machining industrial applications is presented in this paper. The development processes of the servo feed drive have passed through three main stages. The first stage focused on design and development of a linear piezoelectric ultrasonic motor. The second one concentrated on development of an electronic driver and its embedded software. The integration, testing, and validation in electro discharge machining system, was the last stage of the development iifecycle. The linear piezoelectric ultrasonic motor consists of three main parts, the stator, rotor, and sliding element. The motor design process, basic configuration, principles of motion, finite element analysis, and experimental examination of the main characteristics are discussed in this paper. The electronic driver of the ultrasonic motor consists of two main stages, the booster and piezoelectric amplifier. The piezo amplifier consists of four output transistors, a push-pull and bridge, connected in order to achieve the necessary electrical parameters to drive and control the motor servo feed drive traveling speed. The essential expérimentai arrangement to implement arjd examine the developed ultrasonic servo feed drive in an electro discharge machining system was carried out. The initial results showed that the servo drive is abie to provide: a r-eversible directional of motion, no-load traveling speed equal to 28 mm per s. maximum load of 0.78N, a resolution <50p.m, arid a dynamic time response <10ms. The electr-on microscopic micrv examination into the machined samples showed that: ultr-asonic servo drive showed a clear improvement in the surface profile finish, a notable reduction in the stability, processing time, material removal rate, ar-cing, and short-circuiting teething phenomena. This was verified by assessing the electrode movements, the variations of the inter electrode gap voltage, current, and feedback control signals.

show abstract

Application of Commercial Finite Element Codes for the Analysis of Induced Strain-Actuated Structures

Cited by 34 publications

References 2 publications

Fracture Mechanics of Piezoelectric and Ferroelectric Solids

Fracture Mechanics of Piezoelectric and Ferroelectric Solids

Residual stress modeling of density modulated silicon thin films using finite element analysis

A Piezoelectric Servo Feed Drive for Electro Discharge Machining System Industrial Applications Using Linear Ultrasonic Motor

Contact Info

Product

Resources

About