Application of Copper-Carbon Fiber Composites to Power Semiconductor Devices

The effects of interfacial bonding on mechanical properties of single-walled carbon nanotube reinforced copper matrix nanocomposites

“…The incorporation of carbon nanotubes and nickel-coated carbon nanotubes in the copper matrix decreased the friction coefficients and increased intervals up to the onset of scuffing, compared with those of the pure copper specimen. The superior tribological properties of carbon particles, such as carbon nanotubes and nickeldoped diamond like carbon materials, have been actively investigated [9,10,24]. The friction coefficients of the nickelcoated nanotube reinforced nanocomposites (0.5 vol%) were larger than those of the nanotube reinforced nanocomposites (0.5 vol%).…”

“…Metal matrix composites with carbon-based reinforcements have been widely investigated. In particular, copper matrix composites with a low thermal expansion, high electrical and thermal conductivity coefficients were studied for the application to electrical contact materials such as brushes in electric motors [9]. In a recent study of CNT reinforced copper matrix nanocomposites by Cha et al [2], carbon nanotubes were shown to be the most effective reinforcements.…”