Application of eddy-current testing technique for high-density double-Layer printed circuit board inspection

Chomsuwan, Komkrit; Yamada, S.; Iwahara, M.; Wakiwaka, Hiroyuki; Shoji, S.

doi:10.1109/tmag.2005.855173

Cited by 25 publications

(7 citation statements)

References 3 publications

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“…By using the lock-in amplifier, the proposed ECT probe was capable of inspecting the 50-m conductor disconnection located on the 70-m PCB conductor width. However, scanning speed was restricted at around 0.001 m/s [3]. Fig.…”

Section: B Inspection Performancementioning

confidence: 99%

Improvement on Defect Detection Performance of PCB Inspection Based on ECT Technique With Multi-SV-GMR Sensor

2007

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This paper describes the improvement on the defect detection performance of printed circuit board (PCB) inspection based on the eddy-current testing (ECT) technique with the multispin-valve giant magnetoresistance (SV-GMR) sensor. To obtain the ECT signal in the same scanning line, SV-GMR sensors are mounted on the exciting coil in the same column parallel with the scanning direction. Harmonic analysis based on the Fourier transform is used to analyze the signal from the SV-GMR sensor in order to increase scanning speed. Then signal averaging is applied to the ECT signal in order to improve the signal-to-noise ratio. Experimental results are performed to verify the inspection performance.Index Terms-Eddy-current testing (ECT), multisensor, printed circuit board (PCB), scanning speed, signal averaging, signal-to-noise ratio (SNR), spin-valve giant magnetoresistance (SV-GMR).

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Section: B Inspection Performancementioning

confidence: 99%

Improvement on Defect Detection Performance of PCB Inspection Based on ECT Technique With Multi-SV-GMR Sensor

2007

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“…However, after the hot press of the multilayer PCB, due to the different properties of the ARTICLE material surfaces and/or due to the impurities on the materials, strong adhesion between the component layers may not be obtained or, in some areas, the interface can be easily peeled off. [11][12][13] In this study, to improve the adhesion properties between prepreg and a component layer during the hot press, a plasma press method, where, two surfaces are hot pressed together while a plasma is turned on between the two surfaces, was investigated. Generally, to improve the adhesion between different materials further, a plasma treatment method has been generally applied before the adhesion processing for activation of surfaces as pretreatment methods not during the processing.…”

Section: Introductionmentioning

confidence: 99%

Improved Adhesion Between Copper and Prepreg Using Plasma Press Process

Kim¹,

Mun²,

Yeom³

2016

sci adv mater

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For the various next generation flexible devices such as wearable devices, implantable devices, etc., adhesion strength between different surfaces is very important for the reliable operation of the devices. In this study, to improve the adhesion strength between metal (Cu) and polymer substrate (prepreg), a plasma press process, where two surfaces are hot pressed together while generating a plasma between them, were used and the effect of plasma press method on the adhesion strength between prepreg and Cu were investigated and the results were compared with a conventional hot press method. When the prepreg surface was treated with a plasma using He/N 2 /O 2 or He/O 2 before hot press, the adhesion strength was decreased compared to the hot press without previous plasma treatment due to the hardening of the prepreg surface before the hot press. In contrast, when the Cu surface was treated with a plasma using He/N 2 /O 2 or He/O 2 before hot press, the adhesion strength was increased about 20% compared to the hot press only due to the formation hydroxyl group and Cu 2+ on the Cu surface before the hot press. However, when the prepreg and Cu were plasma pressed together, the use of He/O 2 and He/N 2 /O 2 improved the adhesion strength significantly about 35% and 75%, respectively, compared to the hot press only due to the activation of the prepreg surface and Cu surface during the hot press by forming dangling bonds on the surfaces in addition to the formation of hydroxyl group and oxygen bonding on the surfaces.

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“…Along with a variety of methods that include ultrasonic testing, dye penetrants and X-ray, eddy current testing is also commonly used for detecting fatigue cracks in conductive materials such as aircraft carriers and jet engines (Dogaru, C. Smith, Schneider, & S. Smith, 2004;Grimberg, Udpa, Udpa, & Savin, 2005;Uesaka et al, 1995). Recently, high frequency eddy current testing has been developed to detect micro defects on micro conductors of bare PCBs with various types of pick up sensors (Chomsuwan, Yamada, & Iwahara, 2007a, 2007bChomsuwan, Yamada, Iwahara, Wakiwaka, & Shoji, 2005;Kacprzak, Taniguchi, Nakamura, Yamada, & Iwahara, 2001;Yamada et al, 2004;Yamada, Chomsuwan, Hagino, Tian, & Iwahara, 2005;Yamada, Chomsuwan, & Iwahara, 2006;Yamada, Nakamura, Iwahara, Taniguchi, & Wakiwaka, 2003). In this paper, a low frequency eddy current testing probe structure is proposed which consists of Helmholtz coils exciter and a pick-up sensor made of 5 turn coils in planar array.…”

Section: Introductionmentioning

confidence: 99%

Printed Circuit Board Fault Inspection Based on Eddy Current Testing Using Planar Coil Sensor

Soeung¹,

Ali²,

Khir³

et al. 2014

MAS

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This paper presents a printed circuit board (PCB) fault inspection method using eddy current testing generated from Helmholtz coils with a planar array-coil sensor to locate and inspect short and open faults on uniformly spaced interconnect single layer PCBs. The differences between the induced voltages from fault-free boards and faulty boards will be recorded in tables and translated into contour plots. The experimental results showed that in the presence of a short fault, the differences between the induced voltages from fault-free and faulty boards are highly negative. However, in the presence of an open fault, the differences between the induced voltages from fault free and faulty boards are highly positive. These highly positive or negative induced voltages can be translated into high density color regions on contour plots. The potential fault positions can be located by observing the color regions of the contour plots with respect to each element of the matrix sensor.

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Application of eddy-current testing technique for high-density double-Layer printed circuit board inspection

Cited by 25 publications

References 3 publications

Improvement on Defect Detection Performance of PCB Inspection Based on ECT Technique With Multi-SV-GMR Sensor

Improvement on Defect Detection Performance of PCB Inspection Based on ECT Technique With Multi-SV-GMR Sensor

Improved Adhesion Between Copper and Prepreg Using Plasma Press Process

Printed Circuit Board Fault Inspection Based on Eddy Current Testing Using Planar Coil Sensor

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