Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

Lee, Baik-Woo; Jang, Woosoon; Kim, Dong-Won; Jeong, Jeung‐hyun; Nah, Jae-Woong; Paik, Kyung‐Wook; Kwon, Dongil

doi:10.1016/j.msea.2004.03.068

Cited by 13 publications

(3 citation statements)

References 7 publications

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“…Table A1 shows the identification results. When the combination of the virtual displacement fields of u i (1) , u i (2) and u i (3) (i = x, y) is used, the identification results are approximately the same as the results for the automatically determined virtual fields in table 2. On the other hand, the other combinations of the virtual displacement fields result in the incorrect values of the coefficients of thermal expansion.…”

Section: Appendix a Identification Of The Coefficients Of Thermal Exp...mentioning

confidence: 65%

“…and Λ (1) ∼ Λ (2) are not used here. Two virtual displacements are obtained by solving equation (12).…”

Section: Determination Of Appropriate Virtual Displacementsmentioning

confidence: 99%

“…Furthermore, the properties of the materials that make up such electronic devices may differ from those obtained using material testing of single homogeneous samples due to the effects of miniaturization and heat treatment. Full-field measurement methods have long been used to investigate the thermal stresses and strains of such electronic devices [1][2][3][4][5]. A finite element model is verified using the full-field measurement results [6].…”

Section: Introductionmentioning

confidence: 99%

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Identifying the coefficients of thermal expansion of an electronic device composed of various materials using the virtual fields method

Kanai

Arikawa²,

Fujimoto

et al. 2021

Meas. Sci. Technol.

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A method for inverse determination of the coefficients of thermal expansion of an electronic device that is composed of multiple materials, i.e. dissimilar materials, is proposed. The virtual fields method is applied for obtaining the coefficients of thermal expansion. Appropriate virtual displacement fields have been automatically obtained instead of using any arbitrary virtual displacement. This leads to an accurate and effective determination of the coefficient of thermal expansion. Full-field displacement distributions measured by digital image correlation are used as input for the inverse analysis. The validity of the proposed method has been demonstrated by measuring samples made of various materials. Furthermore, the proposed method is applied to samples simulating electronic devices with and without constraints on the boundary. Results show that the coefficients of thermal expansion of an object composed of dissimilar materials are obtained properly. The proposed method is expected to be used for determining the coefficients of thermal expansion of actual electronic devices.

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Section: Appendix a Identification Of The Coefficients Of Thermal Exp...mentioning

confidence: 65%

“…and Λ (1) ∼ Λ (2) are not used here. Two virtual displacements are obtained by solving equation (12).…”

Section: Determination Of Appropriate Virtual Displacementsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Identifying the coefficients of thermal expansion of an electronic device composed of various materials using the virtual fields method

Kanai

Arikawa²,

Fujimoto

et al. 2021

Meas. Sci. Technol.

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show abstract

Thermal Deformation Measurement in Thermoelectric Coolers by ESPI and DIC Method

Wang

2011

Optical Measurements, Modeling, and Metrology, Volume 5

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A developed full-field fem analysis combined with ESPI for the investigation of defect evolution in polymer films

et al. 2013

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Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

Cited by 13 publications

References 7 publications

Identifying the coefficients of thermal expansion of an electronic device composed of various materials using the virtual fields method

Identifying the coefficients of thermal expansion of an electronic device composed of various materials using the virtual fields method

Thermal Deformation Measurement in Thermoelectric Coolers by ESPI and DIC Method

A developed full-field fem analysis combined with ESPI for the investigation of defect evolution in polymer films

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