Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance

Leong, Wei Chiat; Abdullah, M. Z.; Khor, C. Y.

doi:10.1016/j.microrel.2011.11.003

Cited by 35 publications

(18 citation statements)

References 28 publications

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“…The validation of the present numerical technique had been demonstrated in the authors' recent work (Leong et al, 2012b). In the present study, as shown in Figure 6, the inlet is manipulated at different locations, such as inlets A, B, C, D, and E, to examine the inlet location effect on the behavior of the motherboard.…”

Section: Case Studiesmentioning

confidence: 83%

“…The present study utilizes the similar FPCB motherboard test vehicle and also similar numerical technique with the authors' recent work (Leong et al, 2012b). The FSI numerical analyses are performed using the fluid flow solver FLUENT 6.3.26 and structural solver ABAQUS/CAE 6.9; they are online real-time coupled by MpCCI 3.1.0.…”

Section: Modeling Strategymentioning

confidence: 99%

“…The authors' recent work (Leong et al, 2012b) has studied the few physical design issues on the novel approach of FPCB motherboard. In the study, the deflection and stress considerations were found to be vital for the FPCB motherboard.…”

Section: Introductionmentioning

confidence: 99%

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Study on the fluid‐structure interaction of flexible printed circuit board motherboard in personal computer casings

Leong

Abdullah

Khor

et al. 2013

Microelectronics International

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Purpose -The flexible printed circuit board (FPCB) can be an alternative to the rigid printed circuit board because of its excellent flexibility, twistability, and light weight. Using FPCB to construct personal computer (PC) motherboard is still rare. Therefore, the present study aims to investigate the fluidstructure interaction (FSI) behaviors of the newly proposed FPCB motherboard under fan-flow condition in the PC casings. Design/methodology/approach -The deflection and stress induced, which are usually ignored in the traditional rigid motherboard, are the main concern in the current FPCB motherboard studies. Only a few studies have been conducted on the effect of inlet locations, effect of inlet sizes, effect of multi-inlets, and effect of a two-fan system. These numerical analyses are performed using the fluid flow solver FLUENT and the structural solver ABAQUS; they are real-time online coupled by Mesh-based Parallel Code Coupling Interface (MpCCI). Findings -A smaller inlet size can cause higher deflection and stress fluctuations, but the fluctuations can be reduced by incorporating the multi-inlets design. In addition, the inlet locations and two-fan system can prominently affect the magnitudes of the deflection and stress induced.Practical implications -The current study provides better understanding and allows designers to be aware of the FSI phenomenon when dealing with the FPCB motherboard. Although the present study primarily focuses on the motherboard, the findings could also contribute valuable information for other FPCB applications. Originality/value -The present study extends the FSI investigation from the previous novel approach of FPCB motherboard, and uniquely explores the behaviors of the FPCB motherboard inside different PC casings.

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Section: Case Studiesmentioning

confidence: 83%

Section: Modeling Strategymentioning

confidence: 99%

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Study on the fluid‐structure interaction of flexible printed circuit board motherboard in personal computer casings

Leong

Abdullah

Khor

et al. 2013

Microelectronics International

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“…Of the variety of available packaging approaches, electrical connections using flexible printed circuits (FPCs) represent one of the most important technologies for meeting these demands due to their beneficial properties such as their marginal weight, thinness, and flexible form factors [1,2]. In general, a dedicated connector or anisotropic conductive film (ACF) is used to connect FPCs to printed circuits and other electronic components.…”

Section: Introductionmentioning

confidence: 99%

Electrical Reliability of a Film-Type Connection during Bending

et al. 2015

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With the escalating demands for downsizing and functionalizing mobile electronics, flexible electronics have become an important aspect of future technologies. To address limitations concerning junction deformation, we developed a new connection method using a film-type connector that is less than 0.1 mm thick. The film-type connector is composed of an organic film substrate, a UV-curable adhesive that deforms elastically under pressure, and electrodes that are arranged on the adhesive. The film-type connection relies on a plate-to-plate contact, which ensures a sufficient contact area. The electrical reliability of the film-type connection was investigated based on changes in the resistance during bending at curvature radii of 70, 50, 25, 10, 5, and 2.5 mm. The connection was bent 1000 times to investigate the reproducibility of the connector's bending properties. The tests showed that no disconnections occurred due to bending in the vertical direction of the electrode, but disconnections were observed due to bending in the parallel direction at curvature radii of 10, 5, and 2.5 mm. In addition, the maximum average change in resistance was less than 70 milliohms unless a disconnection was generated. These results support the application of the new film-type connection in future flexible devices.

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“…Moreover, it can minimize the cost of long-term research activity. Simulation modeling has several applications in electronic packaging, such as integrated circuit (IC) encapsulation [1], fluid-structure interaction (FSI) in molded underfill [2], wire sweep analysis [3], thermal coupling method on ball grid array package reflow soldering [4], and flexible printed circuit board (PCB) [5].…”

Section: Introductionmentioning

confidence: 99%

Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering

Aziz

Abdullah

Khor

et al. 2014

Advances in Mechanical Engineering

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An effective simulation approach is introduced in this paper to study the thermal fluid-structure interaction (thermal FSI) on the effect of pin-through-hole (PTH) diameter on the wave soldering zone. A 3D single PTH connector and a printed circuit board model were constructed to investigate the capillary flow behavior when passing through molten solder (63SnPb37). In the analysis, the fluid solver FLUENT was used to solve and track the molten solder advancement using the volume of fluid technique. The structural solver ABAQUS was used to examine the von Mises stress and displacement of the PTH connector in the wave soldering process. Both solvers were coupled by MpCCI software. The effects of six different diameter ratios (0.1 < / < 0.97) were studied through a simulation modeling. The use of ratio / = 0.2 yielded a balanced filling profile and low thermal stress. Results revealed that filling level, temperature, and displacement exhibited polynomial behavior to / . Stress of pin varied quadratically with the / . The predicted molten solder profile was validated by experimental results. The simulation results are expected to provide better visualization and understanding of the wave soldering process by considering the aspects of thermal FSI.

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Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance

Cited by 35 publications

References 28 publications

Study on the fluid‐structure interaction of flexible printed circuit board motherboard in personal computer casings

Study on the fluid‐structure interaction of flexible printed circuit board motherboard in personal computer casings

Electrical Reliability of a Film-Type Connection during Bending

Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering

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