Application of Karhunen-Loève Expansions for the Dynamic Analysis of a Natural Convection Loop for Known Heat Flux

Hummel, Tobias; Pacheco-Vega, Arturo

doi:10.1088/1742-6596/395/1/012121

Cited by 6 publications

(1 citation statement)

References 17 publications

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“…It is, however, of best interest to select a set of basis functions that offer the best approximation for the exact solution using a smallest number of modes. In this paper, POD is used to derive basis functions that are optimal in the least squares sense [36], [37]. An optimal set of the POD modes can be obtained by maximizing the mean square inner product of the thermal solutions with the POD mode in the selected physical domain…”

Section: Thermal Model Derivation Based On Podmentioning

confidence: 99%

Thermal Modeling of Multi-Fin Field Effect Transistor Structure Using Proper Orthogonal Decomposition

Jia

Helenbrook

Cheng

2014

IEEE Trans. Electron Devices

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An approach is proposed to project thermal behavior in a semiconductor integrated-circuit structure onto a functional space based on the proper orthogonal decomposition (POD). The approach substantially reduces the numerical degrees of freedom (DOF) needed for thermal simulations and requires no assumptions about physical geometry, dimensions, or heat flow paths. The POD approach is applied to a multi-fin FinFET structure having heat sources driven by power pulse excitations with time shifts, width variations, and amplitude modulations. The POD models were compared with detailed numerical simulations (DNS) and it was shown that the POD approach provides thermal solutions that were as accurate and detailed as the DNS. It offers a reduction in numerical DOFs by nearly six orders of magnitude to capture the peak temperatures in multi-fin FinFETs.Index Terms-Compact thermal model (CTM), FinFET, proper orthogonal decomposition (POD), reduced-order model (ROM), thermal simulation.

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Section: Thermal Model Derivation Based On Podmentioning

confidence: 99%