Application of micro/nano technology for thermal management of high power LED packaging – A review

Hamidnia, Mohammad; Luo, Yi; Wang, X.D.

doi:10.1016/j.applthermaleng.2018.09.078

Cited by 90 publications

(27 citation statements)

References 105 publications

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“…Several technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed. Thermal modeling is useful in analyzing the heat transfer performance of light-emitting diodes (LEDs) [2,3] and insulated-gate bipolar transistors [4] as it reveals junction temperature, thermal conductivity, and thermal resistance [5,6]. However, temperature and thermal resistance are limited in characterizing energy transmission states systematically.…”

Section: Introductionmentioning

confidence: 99%

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Cai

Cui

Qin

et al. 2020

Entropy

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Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed widely. Defect analysis based on the irreversibility entropy generation methodology is favorable for electronic and mechanical components because the second law of thermodynamics plays a unique role in the analysis of various damage assessment problems encountered in the engineering field. In recent years, numerical and theoretical studies involving entropy generation methodologies have been carried out to predict and diagnose the lifetime of electronic and mechanical components. This work aimed to review previous defect analysis studies that used entropy generation methodologies for electronic and mechanical components. The methodologies are classified into two categories, namely, damage analysis for electronic devices and defect diagnosis for mechanical components. Entropy generation formulations are also divided into two detailed derivations and are summarized and discussed by combining their applications. This work is expected to clarify the relationship among entropy generation methodologies, and benefit the research and development of reliable engineering components.

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Section: Introductionmentioning

confidence: 99%

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Cai

Cui

Qin

et al. 2020

Entropy

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“…The main applications of TIMs have been in the fields of microelectronics, power electronics and LED lighting 1 , 3 , 30 , 31 . Although less explored, another important field of TIM application is the thermoelectric generator (TEG).…”

Section: Introductionmentioning

confidence: 99%

Hybrid carbon thermal interface materials for thermoelectric generator devices

Chung

Kim

2020

Sci Rep

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Thermal interface materials (TIMs) are extensively used in electronic devices as efficient heat transfer materials. We fabricated all-carbon TIMs by hybridizing single-wall carbon nanotubes (SWCNTs) with graphite and demonstrated their performance by applying them to a thermoelectric generator (TEG) device. The hybrid carbon TIM exhibited maximum thermal conductivity when the SWCNT content was near 10 wt%. The TIM thermal contact resistance measured by a home-made calorimeter setup was 2.19 × 10−4 m2K/W, which did not vary with temperature but decreased with applied pressure. Post-treatment of the TIM with a silane coupling agent further reduced the TIM thermal contact resistance by 30%. When the TIM was placed between a TEG device and a copper heat reservoir, the TEG output power increased with the temperature difference across the TEG and applied pressure. Moreover, the post-treatment of the TIM enhanced the output power of the TEG device by up to 18.5%. This work provides a simple and effective pathway towards a carbon-based TIM that can be applied to a high temperature TEG.

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“…On the other hand, the fast advancement of nanofabrication technology in recent years has enabled fabricating surface coatings with precisely controlled micro/nanostructures. One promising application of nanoengineered coatings is to dramatically enhance boiling/evaporative heat transfer, offering a potential solution to the overheated electronics (Hamidnia et al, 2018). However, designing optimal coatings for boiling/evaporative heat transfer enhancement remains a major challenge, largely due to the wide range of materials and methods to fabricate nanocoatings, as well as the diverse microscopic morphologies/structures and accordingly significantly different heat transfer performances.…”

Section: Introductionmentioning

confidence: 99%

Multiscale modelling of nucleate boiling on nanocoatings for electronics cooling—From nanoscale to macroscale

2020

Exp. Comput. Multiph. Flow

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Application of micro/nano technology for thermal management of high power LED packaging – A review

Cited by 90 publications

References 105 publications

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Hybrid carbon thermal interface materials for thermoelectric generator devices

Multiscale modelling of nucleate boiling on nanocoatings for electronics cooling—From nanoscale to macroscale

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