Application of no-flow underfill for a reliable high performance Flip Chip Flex BGA

Teo, Poi-Siong; Lim, Suo Hon; Chai, Taichong; Iyer, M.K.

doi:10.1109/ectc.2002.1008131

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

DOI: 10.1109/ectc.2002.1008131

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Application of no-flow underfill for a reliable high performance Flip Chip Flex BGA

Poi-Siong Teo

Suo Hon Lim

Taichong Chai

et al.

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Application of no-flow underfill for a reliable high performance Flip Chip Flex BGA

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References 8 publications

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