1993
DOI: 10.1016/0924-4247(93)80197-o
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Application of oxygen plasma processing to silicon direct bonding

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Cited by 40 publications
(27 citation statements)
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“…Since silicone elastomer is extremely hydrophobic, bonding two layers can be difficult. Although oxygen plasma bonding [43] is often used to bond Polydimethylsiloxane (PDMS), attempts to bond Ecoflex using this method were unsuccessful. To achieve good bonding, the patterned layer was kept in the oven at 65°C while the top layer was spin-coated with Ecoflex at low speed (350 rpm), and then for the last 20 seconds at a greater speed (1600 rpm) spreading the Ecoflex as a flat, uniform and very thin layer, thus preventing the channels to be filled in the next step, as shown in previous work [16].…”
Section: Heating First Layer Sensor's Top Layer Curingmentioning
confidence: 99%
“…Since silicone elastomer is extremely hydrophobic, bonding two layers can be difficult. Although oxygen plasma bonding [43] is often used to bond Polydimethylsiloxane (PDMS), attempts to bond Ecoflex using this method were unsuccessful. To achieve good bonding, the patterned layer was kept in the oven at 65°C while the top layer was spin-coated with Ecoflex at low speed (350 rpm), and then for the last 20 seconds at a greater speed (1600 rpm) spreading the Ecoflex as a flat, uniform and very thin layer, thus preventing the channels to be filled in the next step, as shown in previous work [16].…”
Section: Heating First Layer Sensor's Top Layer Curingmentioning
confidence: 99%
“…Zucker et al 22 reported that plasma oxidized silicon wafers formed an ''active'' oxide surface which was strongly hydrophilic. We will therefore assume that the plasmaoxidized surface contains hydrophilic defects.…”
Section: Introductionmentioning
confidence: 99%
“…Usually the gas consists of water or hydrocarbons [28], which at high temperature can only be dissolved in small amounts in the bulk Si or the interfacial oxide layer. Microdefects at the surface then serve as nucleation sites for bubble formation [29], as is frequently observed after oxygen plasma treatment [30]. For this reason, plasma cleaned wafers are often found to be highly covered with voids (b), affecting the local bonding quality.…”
Section: Resultsmentioning
confidence: 99%