“…Tungsten–copper (W-Cu) pseudo-alloys are widely used in the manufacturing of electrical contact materials, electrodes, thermal management devices, and conductive inks for ceramic metallization due to their high electrical conductivity, high thermal conductivity, low coefficient of thermal expansion (CTE), and many other excellent properties [ 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 ]. With the rapid development of microelectronics and packaging technology, W-Cu heat sink components become smaller, and their shapes become more complex.…”