Application of USM to micromachining by on-the-machine tool fabrication

Egashira, Kai; Masuzawa, Takahisa; Fujino, Masataka; Sun, Xi-Qing

doi:10.1109/korus.2000.866068

Cited by 9 publications

(17 citation statements)

References 7 publications

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“…Flexibility and feasibility of machining micro components using ultrasonic machining (USM) have already been demonstrated [2][3][4]. Hard and brittle materials like glass, silicon wafers and ceramics could easily be machined by USM in the micro domain too [5].…”

Section: Introductionmentioning

confidence: 99%

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Tool wear studies in fabrication of microchannels in ultrasonic micromachining

2015

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Section: Introductionmentioning

confidence: 99%

“…However, conflicting opinions were revealed for SS tool in USM at micro levels [2,3,[12][13][14]. Some studies in ultrasonic micromachining include development of models for predicting tool wear [10].…”

Section: Introductionmentioning

confidence: 99%

Tool wear studies in fabrication of microchannels in ultrasonic micromachining

2015

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“…The experiments are carried out on a microultrasonic machine (ASWU-l, Creative Technology) having three NC axes with a minimum increment of 0.05Jlm. The machine is equipped with an RC circuit for fabricating ultrasonic machining tools by EDM 5) and is used in the present experiments. The feeding motion of the electrode is controlled by measuring the average charging current (obtained from the voltage over the charging resistor).…”

Section: Methodsmentioning

confidence: 99%

EDM at Low Open-Circuit Voltage

2005

IJEM

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The possibilities for electrical discharge machining (EDM) at open-circuit voltages lower than 30V are examined using an RC circuit. Low voltages are preferable in terms of machining accuracy. However, machining at such voltages has not been attempted before. Drilling in copper is carried out using tungsten electrodes with 15Jlm and 7Jlm diameters to investigate the material removal rate. At open-circuit voltages of 5V or higher, the average electrode feed speed, defined as the feed length per machining time, is higher than 5Jlmlmin under certain electrical conditions. Although the material removal rate is very low, machining is possible even at an open-circuit voltage of 2V. These voltages are much lower than for conventional EDM. A tungsten pin IJlm in diameter could be fabricated at an open-circuit voltage of 20V by wire electrodischarge grinding (WEDG), suggesting possible future applications of EDM to submicron machining and nanomachining.

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“…zones. This method was applied using electrodischarge machining [4], [5], ultrasonic machining [6], [7], laser ablation [8], laser-assisted chemical etching [9] and laser or electron beam exposure of photoresist [10], [11]. v) Stereolithography [12], [13].…”

Section: Introductionmentioning

confidence: 99%

The MEMSNAS Process: Microloading Effect for Micromachining 3-D Structures of Nearly All Shapes

Bourouina

Masuzawa

Fujita

2004

J. Microelectromech. Syst.

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We propose a technological process for microfabrication of three-dimensional (3-D) structures with nearly all shapes. This is a one-mask process that uses equipment, widespread in the microelectronics laboratories and industry. The main idea is to take advantage from the microloading effect of reactive ion etching (RIE) in order to obtain multiple levels of heights in an array of microholes of different diameters. A 3-D profile results from an overlap of the neighboring microholes due to the isotropic nature of the etching. The final continuous and smooth 3-D structure is obtained after removal of the mask material and a second isotropic RIE step. This fabrication process was validated with the realization of various 3-D structures including microlenses, etched in a 30m deep cavity, with 375 m in radius and 10 m in height (sag). The resulting structures have shown a roughness down to 25 nm.A quantitative experimental study led to the calibration of three different processes and to an empirical theoretical model, which can serve as a basis of design rules for further fabrication of 3-D microstructures.[809]Index Terms-Loading effect, micromachining, reactive ion etching (RIE), three-dimensional (3-D).

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Application of USM to micromachining by on-the-machine tool fabrication

Cited by 9 publications

References 7 publications

Tool wear studies in fabrication of microchannels in ultrasonic micromachining

Tool wear studies in fabrication of microchannels in ultrasonic micromachining

EDM at Low Open-Circuit Voltage

The MEMSNAS Process: Microloading Effect for Micromachining 3-D Structures of Nearly All Shapes

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