Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study

Chiu, Meng-Chun; Tsai, Min-Yan; Wang, Shan-Bo; Lin, Yung-Sheng; Liang, Chien-Lung

doi:10.1016/j.surfcoat.2024.130828

Surface and Coatings Technology

2024

DOI: 10.1016/j.surfcoat.2024.130828

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Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study

Meng-Chun Chiu,

Min-Yan Tsai,

Shan-Bo Wang

et al.

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Low-temperature attaching of LED chips using SnBiIn solder nanoparticles

Mao,

An,

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et al. 2024

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Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study

Cited by 1 publication

References 84 publications

Low-temperature attaching of LED chips using SnBiIn solder nanoparticles

Low-temperature attaching of LED chips using SnBiIn solder nanoparticles

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