Applications of Scanning Probe Methods in Chemical Mechanical Planarization

Kasai, Toshihiro; Bhushan, Bharat

doi:10.1007/978-3-540-74085-8_4

Cited by 2 publications

(1 citation statement)

References 47 publications

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“…Especially, for an AFM tip made of silicon nitride, the tip becomes hydrolyzed in an aqueous solution, and has a layer of silicon dioxide on the top, which is of the same material of the silica particle. 21 Therefore, silicon nitride trigonal cantilever probes (RTESP, Veeco Co.), with the spring constant of 0.12 N/m, were used for the measurement of forcedistance (F-D) curves. The cantilever spring constants were calibrated using the thermal tuning method.…”

Section: Methodsmentioning

confidence: 99%

Role of the Adhesion Force during Copper Chemical Mechanical Planarization

Li¹,

Liu²,

Cheng³

et al. 2018

ECS J. Solid State Sci. Technol.

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The adhesion force between slurry particles and the wafer surface has a significant effect on the material removal and ultra-smooth surface formation during the chemical mechanical polishing/planarization (CMP) process. Based on zeta potentials measurements, we calculate the value of adhesion force, which cannot be ignored compared with the Hertz contact force for small sized abrasive particles at low polishing pressures. More over, the impacts of slurry (particle size and pH value) and wafer surface roughness on the adhesion force are evaluated. Theoretical analyses manifest that the adhesion force mainly originates from the van der Waals force and electrical double-layer force, which increases with the increase of the particle size and slurry pH, while decreases with the increase of the wafer surface roughness. The relationships between the adhesion force and scratch depth indicate that scratching would be avoided while enhancing the adhesion force during CMP. These findings would provide some inspirations to understand the CMP technology in depth, and they are also beneficial to engineering super-smooth and super-lubricant surfaces with nano-scaled roughness.

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Section: Methodsmentioning

confidence: 99%

Role of the Adhesion Force during Copper Chemical Mechanical Planarization

Li¹,

Liu²,

Cheng³

et al. 2018

ECS J. Solid State Sci. Technol.

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Mechanical Property Investigation of Soft Materials by Cantilever‐Based Optical Interfacial Force Microscopy

Kim¹,

Boehm²

2012

Scanning

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Cantilever-based optical interfacial force microscopy (COIFM) was applied to the investigation of the mechanical properties of soft materials to avoid the double-spring effect and snap-to-contact problem associated with atomic force microscopy (AFM). When a force was measured as a function of distance between an oxidized silicon probe and the surface of a soft hydrocarbon film, it increases nonlinearly in the lower force region below ∼10 nN, following the Herzian model with the elastic modulus of ∼50 MPa. Above ∼10 nN, it increases linearly with a small oscillatory sawtooth pattern with amplitude 1-2 nN. The pattern suggests the possible existence of the layered structure within the film. When its internal part of the film was exposed to the probe, the force depends on the distance linearly with an adhesive force of -20 nN. This linear dependence suggests that the adhesive internal material behaved like a linear spring with a spring constant of ∼1 N/m. Constant-force images taken in the repulsive and attractive contact regimes revealed additional features that were not observed in the images taken in the noncontact regime. At some locations, however, contrast inversions were observed between the two contact regimes while the average roughness remained constant. The result suggests that some embedded materials had spring constants different from those of the surrounding material. This study demonstrated that the COIFM is capable of imaging mechanical properties of local structures such as small impurities and domains at the nanometer scale, which is a formidable challenge with conventional AFM methods.

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Applications of Scanning Probe Methods in Chemical Mechanical Planarization

Cited by 2 publications

References 47 publications

Role of the Adhesion Force during Copper Chemical Mechanical Planarization

Role of the Adhesion Force during Copper Chemical Mechanical Planarization

Mechanical Property Investigation of Soft Materials by Cantilever‐Based Optical Interfacial Force Microscopy

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