2022
DOI: 10.14569/ijacsa.2022.0130878
|View full text |Cite
|
Sign up to set email alerts
|

Approximate TSV-based 3D Stacked Integrated Circuits by Inexact Interconnects

Abstract: Three-Dimensional Stacked Integrated Circuit (3D-SICs) based on Through-Silicon Vias (TSVs) provide a highdensity integration technology. However, integrating pre-tested dies requires post-bond interconnect testing, which is complex and costly. An imperfect TSV-based interconnect indicates a defective chip that should be rejected. Thus, it increases the yield loss and test cost. On the other hand, approximate computing (AC) is a promising design paradigm suitable for errorresilient applications, e.g., processi… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2024
2024
2024
2024

Publication Types

Select...
1
1

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(1 citation statement)
references
References 24 publications
0
1
0
Order By: Relevance
“…Various errorresilient applications, such as machine learning, scientific computing, computer graphics and gaming, and multimedia processing, accept approximation results [22]. Such applications reply to processing big data that are sensorygenerated, do not have a unique or golden output, perform computing utilizing self-attenuation algorithms, and most of their results are consumed by human vision which tolerates errors [23].…”
Section: Approximate Computingmentioning
confidence: 99%
“…Various errorresilient applications, such as machine learning, scientific computing, computer graphics and gaming, and multimedia processing, accept approximation results [22]. Such applications reply to processing big data that are sensorygenerated, do not have a unique or golden output, perform computing utilizing self-attenuation algorithms, and most of their results are consumed by human vision which tolerates errors [23].…”
Section: Approximate Computingmentioning
confidence: 99%