Handbook of Silicon Wafer Cleaning Technology 2018
DOI: 10.1016/b978-0-323-51084-4.00004-6
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Aqueous Cleaning and Surface Conditioning Processes

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Cited by 16 publications
(10 citation statements)
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“…Silicon wafers were cut to a size of 10 × 10 mm 2 and cleaned with “RCA clean 1” to remove organic residues. 28 Briefly, a mixture of ultrapure water and ammonia (Roth, Germany) was heated up to 75°C–80°C and hydrogen peroxide (Roth) was added to achieve a ratio of 5:1:1 (v/v/v). After cleaning the samples for 10 min without additional heating, they were extensively rinsed with ultrapure water (six cycles for 5 min), dried with a stream of nitrogen, and stored in a desiccator until use.…”
Section: Methodsmentioning
confidence: 99%
“…Silicon wafers were cut to a size of 10 × 10 mm 2 and cleaned with “RCA clean 1” to remove organic residues. 28 Briefly, a mixture of ultrapure water and ammonia (Roth, Germany) was heated up to 75°C–80°C and hydrogen peroxide (Roth) was added to achieve a ratio of 5:1:1 (v/v/v). After cleaning the samples for 10 min without additional heating, they were extensively rinsed with ultrapure water (six cycles for 5 min), dried with a stream of nitrogen, and stored in a desiccator until use.…”
Section: Methodsmentioning
confidence: 99%
“…This pretreatment involves a piranha solution that removes the original native silicon oxide lm. The silicon wafer was placed in the piranha solution (H 2 SO 4 : H 2 O 2 ; 7 : 3 vol/vol) for 30 minutes at 80 C. 29,30 Aerward, the wafers were washed with HPLC water and slightly sonicated in order to eliminate traces of sulfuric acid. Then, the wafers were dried with an ultra-pure nitrogen gas jet.…”
Section: Polymeric Lm Preparationmentioning
confidence: 99%
“…The 10% weight loss (TDT 10% ) occured between 490 C and 510 C. The char yields at 720 C were similar in all samples, between 55% and 60%; this is common for silylated samples, principally due to the formation of non-volatile silicon oxides and non-oxidized organic material. 30,37,38 Thermal stability studies performed on the poly(etherazomethines)s based on the decomposition point indicate that they are thermally stable. 39 The high aromatic content due to the biphenyl moieties of both monomers allows inter-chain interactions that increase the thermal stability in a similar way to the effect discussed in the solubility section.…”
Section: Thermal Analysismentioning
confidence: 99%
“…Highly doped n-Si <100> (Si R< 0.003 Ω/cm) substrates were cleaned in aqueous detergent, washed with triple distilled water (TDW), dipped in piranha solution (H2O2/H2SO4 concentrated, 3:7 v/v) for 15 min The substrates were then rinsed with TDW and sonicated in NH3/H2O/H2O2 (1:1:5 v/v/v) solution for 30 min at 60 0 C. 37 The substrates were washed with TDW, pure acetone and then dried under a stream of nitrogen. Freshly cleaned and activated substrates of Si/SiO 2 were immersed in 0.2% (v/v) APTES /ethanol solution for 20 min.…”
Section: Surface Modificationmentioning
confidence: 99%