Aqueous tape casting of silicon nitride

Bitterlich, Bernd; Heinrich, Jürgen G.

doi:10.1016/s0955-2219(02)00029-8

Cited by 62 publications

(46 citation statements)

References 13 publications

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“…Two major nonaqueous tape-casting processes have been developed to produce textured Si 3 N 4 , as listed in table 7. Recently, because of the safety, economic and environmental considerations, the aqueous tape-casting of Si 3 N 4 ceramics has received attention [148][149][150], as listed in table 8. Although these studies do not involve the use of β-Si 3 N 4 seeds, they will undoubtedly be of great help in producing textured Si 3 N 4 by the aqueous TCA technique.…”

Section: Tca Techniquementioning

confidence: 99%

Textured silicon nitride: processing and anisotropic properties

Zhu

Sakka

2008

Science and Technology of Advanced Materials

158

104

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Textured silicon nitride (Si 3 N 4 ) has been intensively studied over the past 15 years because of its use for achieving its superthermal and mechanical properties. In this review we present the fundamental aspects of the processing and anisotropic properties of textured Si 3 N 4 , with emphasis on the anisotropic and abnormal grain growth of β-Si 3 N 4 , texture structure and texture analysis, processing methods and anisotropic properties. On the basis of the texturing mechanisms, the processing methods described in this article have been classified into two types: hot-working (HW) and templated grain growth (TGG). The HW method includes the hot-pressing, hot-forging and sinter-forging techniques, and the TGG method includes the cold-pressing, extrusion, tape-casting and strong magnetic field alignment techniques for β-Si 3 N 4 seed crystals. Each processing technique is thoroughly discussed in terms of theoretical models and experimental data, including the texturing mechanisms and the factors affecting texture development. Also, methods of synthesizing the rodlike β-Si 3 N 4 single crystals are presented. Various anisotropic properties of textured Si 3 N 4 and their origins are thoroughly described and discussed, such as hardness, elastic modulus, bending strength, fracture toughness, fracture energy, creep behavior, tribological and wear behavior, erosion behavior, contact damage behavior and thermal conductivity. Models are analyzed to determine the thermal anisotropy by considering the intrinsic thermal anisotropy, degree of orientation and various microstructure factors. Textured porous Si 3 N 4 with a unique microstructure composed of oriented elongated β-Si 3 N 4 and anisotropic pores is also described for the first time, with emphasis on its unique mechanical and thermal-mechanical properties. Moreover, as an important related material, textured α-Sialon is also reviewed, because the presence of elongated α-Sialon grains allows the production of textured α-Sialon using the same methods as those used for textured β-Si 3 N 4 and β-Sialon.

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Section: Tca Techniquementioning

confidence: 99%

Textured silicon nitride: processing and anisotropic properties

Zhu

Sakka

2008

Science and Technology of Advanced Materials

158

104

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“…In consideration of the health problems of the workers and environmental protection, aqueous tape casting has been paid great attention and it has substituted for nonaqueous tape casting in many fields [11] .…”

Section: Introductionmentioning

confidence: 99%

Combinatorial Processing Study for 0.7(Bi0.95La0.05)FeO3-0.3BaTiO3 Ceramics Produced by an Aqueous Tape Casting Method

Zhu¹,

Jin²

2015

Proceedings of the 2015 International Symposium on Material, Energy and Environment Engineering

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Abstract. 0.7(Bi 0.95 La 0.05 )FeO 3 -0.3BaTiO 3 (0.7BLF-0.3BT) ceramics with pure perovskite structure were produced and packed from an aqueous tape casting method. The effects of pressure and temperature, during the tapes lamination process, on the bulk density and dielectric were systematically investigated to obtain a proper lamination technique for further multilayer structure ceramic devices. The dielectric loss, tanδ decreased with the rising of lamination temperature from 20 to 110 o C due to the stronger combination between the gaps of ceramic tapes and relative higher bulk density. On the contrary, with the rising of lamination pressure from 40 to 160 MPa, The dielectric loss increased due to the serious inner structural broken. The results show that the laminated ceramics derived from tapes casting method exhibit comparable dielectric properties to those prepared by conventional technique, which is the basic step for the continuous developing for piezoelectric devices with multilayered structure.

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“…11 In addition information in the literature on tape casting of Si 3 N 4 materials is limited. [12][13][14][15] We present a detailed account of the processing steps to produce Si 3 N 4 and Si 3 N 4 + TiN ceramic tapes.…”

Section: Introductionmentioning

confidence: 99%