1994
DOI: 10.1051/jp2:1994115
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Ar+ beam sputtering on solid surfaces and nematic liquid crystal orientation

Abstract: The molecular orientation of nematic 5CB on various solid substrates eroded obliquely by an Ar+ ion-beam has been studied experimentally. The sputtering on an isotropic substrate (normally evaporated SiO) results in a nematic planar orientation along the projection of the local velocity of the ion direction on the surface. When using an anisotropic substrate (obliquely evaporated SiO which gives planar orientation in absence of sputtering) we find a continuous twist of the resulting alignment, from the initial… Show more

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Cited by 12 publications
(10 citation statements)
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“…The particle beam processing (PBP) is a general name of methods consisting in the oblique treatment of LC aligning substrates with a directed flux of particles (atoms, ions, electrons or mixtures thereof), which deposit on the substrate [1][2][3] or etch it [4,5]. As the result, the aligning surface becomes anisotropic and capable of LC alignment.…”
Section: Introductionmentioning
confidence: 99%
“…The particle beam processing (PBP) is a general name of methods consisting in the oblique treatment of LC aligning substrates with a directed flux of particles (atoms, ions, electrons or mixtures thereof), which deposit on the substrate [1][2][3] or etch it [4,5]. As the result, the aligning surface becomes anisotropic and capable of LC alignment.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, ploliimides can be substituted by the inorganic aligning layers. Recently, the technologies for creation of aligned nematic LC structures based on treatment of substrate surfaces by low energy ions, ionplasma etching and sputtering were elaborated [1][2][3][4][5][6][7][8]. Among these methods, the special attention deserves the method of cathode reactive sputtering (CRS) of aligning layer by using a direct current (diode system of sputtering) [9,10].…”
Section: Introductionmentioning
confidence: 99%
“…The PBP consists in the oblique treatment of LC aligning substrates with a directed flux of particles (atoms, ions, electrons or mixtures thereof), which deposit on the substrate [1][2][3] or etch it [4,5]. As the result, the aligning surface becomes anisotropic and capable of LC alignment.…”
Section: Introductionmentioning
confidence: 99%
“…Their procedure is based on the anisotropic etching with the ion beam. In contrast to the previous studies [4,5], IBM team uses ions of low energy, which modify only the very top layer of the aligning film. This is achieved by the use of the ion source of Kaufman type.…”
Section: Introductionmentioning
confidence: 99%