Abstract:Reverse engineering is a burning issue in Integrated Circuit (IC) design and manufacturing. In the semiconductor industry, it results in a revenue loss of billions of dollars every year. In this work, an area efficient, high-performance IC camouflaging technique is proposed at the physical design level to combat the integrated circuit’s reverse engineering. An attacker may not identify various logic gates in the layout due to similar image output. In addition, a dummy or true contact-based technique is impleme… Show more
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