Argon-ion laser direct-write Al deposition from trialkylamine alane precursors

Foulon, F.; Stuke, M.

doi:10.1007/bf00539488

Cited by 21 publications

(7 citation statements)

References 32 publications

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“…The minimum resistivity of the Cu deposits in these experiments, 3.6 ⍀-cm, is approximately twice the bulk resistivity of copper (1.68 ⍀-cm). This is consistent with other laser direct writing systems, in which the minimum resistivity values are also about twice the bulk values, i.e., 11 ⍀-cm for LCVD tungsten (bulk value of 5.65 ⍀-cm) 34,36 and 5.6 ⍀-cm for aluminum 37,38 (bulk value of 2.65 ⍀-cm).…”

Section: Resultssupporting

confidence: 91%

Laser Enhanced Electroless Plating of Micron-Scale Copper Wires

Chen¹,

Imen

Allen

2000

J. Electrochem. Soc.

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Laser "direct writing" (LDW) or maskless pattern deposition has been extensively studied for more than a decade. 1,2 LDW is potentially attractive in semiconductor device customization, repair, prototyping, and packaging applications. [3][4][5] Copper is an important metallization material in microelectronic circuits 6,7 and multichip module interconnections, 8,9 largely because of its low electrical resistivity. A major limitation of LDW technologies for device metallization applications using laser chemical vapor deposition (LCVD) techniques has been the lack of Cu precursors with sufficiently high vapor pressure. The most common precursors used for the large area CVD of copper are copper(II) and ligand-stabilized copper(I) ␤-diketonate compounds. 10 While the vapor pressures of these precursors are, in general, sufficient for conventional CVD (deposition rates greater than or equal to a micrometer per hour), they are too low to allow the fast deposition rates (mm/s) required for LCVD applications. Advanced technologies making direct use of liquidphase delivery of precursors to the reaction zone have been developed. Solid-phase precursors can be dissolved into selected solvents such as 2-propanol or ethanol to provide highly controllable flow rates to the reaction zone. 11 Liquid precursors can be dissolved in solvents, 12 made into a paste layer, 13 or used as neat compounds. 14,15 The mechanism of deposition using liquid precursors has been proposed to be either a photochemical 16,17 or thermal decomposition reaction involving one or more precursors. 18,19 Laser-enhanced electroplating 20,21 and electroless plating 22 were first reported by von Gutfeld et al. They reported local plating enhancement rates as high as ϳ10 3 utilizing highly localized heating caused by the absorption of a focused laser beam at the substrate. Self-induced repair (SIR) of microelectronic circuits using joule heating induced local electrodeposition demonstrated by Chen is analogous to laser enhanced electroless plating. 23 The electrochemical conditions necessary for an electroless plating process to take place are (i) the reducing potential of the reductant must be less than that of the reducing potential of the metal and (ii) the metal must have enough catalytic activity for the anodic oxidation to take place at a reasonable rate. In a laser-enhanced electroless plating (LEEP) process the laser-induced temperature rise in the substrate enhances the local chemical reaction, causing the redox reaction to take place and metal to be deposited. The reducing agent needs to be chosen such that reduction takes place at an elevated temperature but not at ambient so that spatially selective laser deposition can take place. The redox potentials of selected reducing agents are listed in Table I. ExperimentalThe experimental setup is shown in Fig. 1. An Ar ion laser delivering a linearly polarized transmission electron microscopy (TEM 00 ) beam was used as the driving energy source. The laser was operated at a single wavelength of 514.5 nm whi...

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Section: Resultssupporting

confidence: 91%

Laser Enhanced Electroless Plating of Micron-Scale Copper Wires

Chen¹,

Imen

Allen

2000

J. Electrochem. Soc.

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“…Besides lithography, LDW can be carried out by material deposition onto a substrate from gaseous, liquid, or solid precursors, as well as direct ablation via material evaporation. For example, Si and Al were patterned on various substrates from silane and trialkylamine alane gas precursors, and Si nanowires (NWs) with precisely controlled position, orientation, length, and doping conditions were fabricated using such a laser direct‐synthesis method . Multilayer patterns can also be formed via repeated scans of the surface.…”

Section: Maskless Nanofabrication Techniquesmentioning

confidence: 99%

Toward Scalable Flexible Nanomanufacturing for Photonic Structures and Devices

et al. 2016

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Continuous and scalable nanopatterning over flexible substrates is highly desirable for both commercial and scientific interests, but is difficult to realize with traditional photolithographic processes. The recent advancements in nanofabrication methodologies enable light management with photonic structures on flexible materials, providing an increasingly popular strategy to control the light harvesting in the optoelectronic devices of photovoltaics, and in organic and inorganic light-emitting diodes. Here, the current status of nanopatterning technologies for the fabrication of optoelectronic devices is summarized. Scalable nanopatterning technologies for nanomanufacturing on flexible materials are emphasized. Critical challenges in various patterning techniques when considering the resolution, scalability, processing throughput, and the use of masks and resists are addressed. The integration of flexible nanopatterned substrates with light manipulation in organic optoelectronic devices is also discussed; this enables the control of light flux and spectra. Finally, potential development directions are highlighted.

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“…1,2 Different types of so-called noncoherent structures ͑not related to light interference phenomena͒ were observed. [3][4][5][6][7][8] The understanding of these structures, as well as the self-consistent description of the pyrolytic LCVD itself require a knowledge of the laser-induced temperature distribution and the modeling of the growth process. In situ temperature measurements are difficult to perform, 9 mainly due to the small size of the reaction zone.…”

Section: Introductionmentioning

confidence: 99%

Modeling of pyrolytic laser direct writing: Noncoherent structures and instabilities

Arnold

Kargl

Bäuerle

1997

Journal of Applied Physics

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Fabrication of a low-operating voltage diamond thin film metal-semiconductor-metal photodetector by laser writing lithography Three-dimensional simulations of pyrolytic laser direct writing from gas-phase precursors are presented. They are based on a fast method for the calculation of temperature distributions induced by an energy beam in deposits of arbitrary shape. Analytical approximations, fast Fourier transform, and the multigrid technique are combined in the algorithm. Temperature dependences of the absorptivities and heat conductivities of the deposit and the substrate have been taken into account. Self-consistent modeling of the growth process allows one to explain oscillations in the height and width of lines caused by the feedback between the shape of the deposit, the temperature distribution, and the growth rate. For the deposition of W from an admixture of WCl 6 ϩH 2 and a-SiO 2 substrates, the oscillations originate from a sharp increase in the absorptivity of the deposit with temperature. With the deposition of Si from SiH 4 , or C from CH 4 , C 2 H 2 , and C 2 H 4 , onto a-SiO 2 , the oscillations are related to the large ratio of height/width of the deposit and the increase in temperature on its upper surface. This increase also explains the transition from line-type to fiber-type growth. The hysteresis of this transition with respect to laser power and scanning velocity is explained as well. The same algorithm can be used in the modeling of pyrolytic etching and e-beam microprocessing when the feedback between the temperature distributions and changes in the processing geometry is important.

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Argon-ion laser direct-write Al deposition from trialkylamine alane precursors

Cited by 21 publications

References 32 publications

Laser Enhanced Electroless Plating of Micron-Scale Copper Wires

Laser Enhanced Electroless Plating of Micron-Scale Copper Wires

Toward Scalable Flexible Nanomanufacturing for Photonic Structures and Devices

Modeling of pyrolytic laser direct writing: Noncoherent structures and instabilities

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