2020
DOI: 10.1109/tmtt.2019.2950224
|View full text |Cite
|
Sign up to set email alerts
|

Artificially Engineered Capacitors for Discrete High-Frequency Electronic Circuitry

Abstract: The concept of the artificially engineered capacitor (AEC) is presented as a 3-D printable 3-D capacitive component for use in discrete RF/microwave electronic circuitry. The intention of the AEC concept is a highly customizable 3-D printable component whose capacitance value is stable over a wider frequency band when compared to commercial alternatives. AECs can be viewed as impedance structures with predominantly capacitive characteristics. Both series and shunt AEC configurations are considered with simulat… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
6
0

Year Published

2020
2020
2023
2023

Publication Types

Select...
4

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
(6 citation statements)
references
References 26 publications
0
6
0
Order By: Relevance
“…The extrusion process can be easily integrated into the multimaterial FFF processes. Figure 3(a) demonstrates the process of printing a metacapacitor by using a hybrid FFF printing method [28]. The conductive meta-atoms are printed using silver-based paste and can be fully sealed inside the thermoplastic material.…”
Section: Comparison Of 3d Printing Techniques For Rf Applicationsmentioning
confidence: 99%
“…The extrusion process can be easily integrated into the multimaterial FFF processes. Figure 3(a) demonstrates the process of printing a metacapacitor by using a hybrid FFF printing method [28]. The conductive meta-atoms are printed using silver-based paste and can be fully sealed inside the thermoplastic material.…”
Section: Comparison Of 3d Printing Techniques For Rf Applicationsmentioning
confidence: 99%
“…In addition to inductors and magnetic components, capacitors can also be made through AM methods, including artifi- cially engineered capacitors [59] and ceramic capacitors [60]. Functioning as energy storage devices in power conversion systems, 3D-printed supercapacitors have also been widely researched in recent years, such as electrical double layer capacitors (EDLCs) made by the paste extrusion process [61].…”
Section: A Passive Componentsmentioning
confidence: 99%
“…Wireless communication antennas [3], energy harvesting rectennas [4], mmWave imaging arrays [5], and RFIC packaging [6] are among the applications tackled through additive manufacturing of microwave and mmWave distributed components. Furthermore, the realization of individual components such as RF capacitors using inkjet [7] and 3D printing [8] has been demonstrated. In low-cost, large-area, printed electronics, and wearable applications, it is desirable to minimize the lumped components count in the system and utilize printed components to maximize flexibility [9].…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the use of interdigital capacitors requires a high resolution fabrication method, not achievable using standard PCB manufacturing, should the transmission line achieve a sufficiently high capacitance for a sub-1 GHz pass-band [16]. Emerging discrete capacitors have been shown operating up to 16 GHz using artificially engineered materials realized using additive manufacturing [8]. However, the achieved high (>1 pF) capacitance is still dependent on a discrete, rigid, lumped component, which is undesirable in flexible and wearable applications.…”
Section: Introductionmentioning
confidence: 99%