2018 41st International Spring Seminar on Electronics Technology (ISSE) 2018
DOI: 10.1109/isse.2018.8443956
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Aspects of additive copper deposition on biodegradable and environmentally friendly PCB substrates (PLA, CA, GPTE-DETDA)

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Cited by 5 publications
(5 citation statements)
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“…These larger vales are due to occasional peaks and valleys in the composite. In case of FR4, the Ra is below 1 µm [29], the latter parameter is slightly more 1 µm [30]. Reducing the roughness is a serious task of the future.…”
Section: Production Resultsmentioning
confidence: 99%
“…These larger vales are due to occasional peaks and valleys in the composite. In case of FR4, the Ra is below 1 µm [29], the latter parameter is slightly more 1 µm [30]. Reducing the roughness is a serious task of the future.…”
Section: Production Resultsmentioning
confidence: 99%
“…Géczy et al showed PLA and cellulose-acetate (CA) boards could be used for surface mounting. The research group also produced several other publications, involving PLA and CA, as PCB substrate [19][20][21][22][23][24][25][26][27]. Recently a promising improvement was introduced by the same team, where flame-retarded PLA was reinforced with flame-retarded flax fibres, to form a biodegradable substrate [27].…”
Section: B Materials and Processes Used To Produce Printed Electronic...mentioning
confidence: 99%
“…Nevertheless, the quality of joints depends on the specific type of biopolymer [45]. Further, instead of standard bismuth-tin solder alloy (58Bi42Sn or 58Bi41Sn1Ag), Rose's alloy with the composition of 50Bi(25-28)Pb (22)(23)(24)(25)Sn can be beneficially utilized thanks to its melting point of 94 °C [17].…”
Section: Assemblingmentioning
confidence: 99%
“…Sustainable and printable substrate materials can be found among different cellulose and wood-based materials, bioplastics, and biocomposites [ 8 , 9 , 10 , 11 , 12 , 13 ]. Electrochemical deposition of copper and tin has been demonstrated on poly(lactic acid) (PLA) substrate and vapor phase reflow soldering has been performed on PLA and cellulose acetate substrates based on copper laminates [ 14 , 15 ]. Wood-based substrate materials are one opportunity for printed circuit board (PCB) manufacturing to replace current plastic and composite materials [ 16 ].…”
Section: Introductionmentioning
confidence: 99%
“…The use of PCBs in electronic devices usually sets specific requirements for surface roughness and adhesion, mechanical durability, temperature stability and moisture tolerance; the use of fire retardants is also often expected [ 14 , 15 , 18 , 19 ]. The capability of wood-based materials to meet these expectations might be limited, but the work reported in this paper aims to show that there are potential material alternatives already available which are compatible with electronic performance and printability requirements.…”
Section: Introductionmentioning
confidence: 99%