2017 IEEE 67th Electronic Components and Technology Conference (ECTC) 2017
DOI: 10.1109/ectc.2017.114
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Assembly and Reliability Challenges for Next Generation High Thermal TIM Materials

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Cited by 15 publications
(3 citation statements)
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“…For this reason, a relatively large temperature gradient between the semiconductor junction and the coolant occurs when dissipating high heat fluxes [203,204]. Many efforts have been focused on the development of advanced TIMs, which reduce their respective R th [205][206][207][208].…”
Section: Power Converter Cooling Technologies Present In the Automoti...mentioning
confidence: 99%
“…For this reason, a relatively large temperature gradient between the semiconductor junction and the coolant occurs when dissipating high heat fluxes [203,204]. Many efforts have been focused on the development of advanced TIMs, which reduce their respective R th [205][206][207][208].…”
Section: Power Converter Cooling Technologies Present In the Automoti...mentioning
confidence: 99%
“…This can lead to the reduction, or in extreme cases, to the failure of heat transfer and therefore to a thermal overload within the battery. The following general failure mechanisms in TIMs are known or described in the literature [9]: migration [10], thermomechanical pump-out [11,12], delamination, cracking [13], decreasing coverage [14], pore formation, bleeding [15], dry-out [16], swelling or leaching by media, and oxidation [17].…”
Section: Degradation Of Thermal Interface Materialsmentioning
confidence: 99%
“…In addition, the design of power modules or cooling systems favors devices with a low R th to maintain the junction temperature, T j , within the acceptable range. The thermal resistance value is directly proportional to the material thickness (t) and inversely proportional to the thermal conductivity (σ) and dissipation area (A) [21][22][23][24][25][26][27][28].…”
Section: Introductionmentioning
confidence: 99%