Assembly and reliability of thermally enhanced high I/O BGA packages

Ejim, T.I.; Hollesen, D.B.; Holliday, A.; Gahr, S.; Coyle, Richard

doi:10.1109/iemt.1997.626868

Cited by 15 publications

(12 citation statements)

References 2 publications

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“…Widespread implementation of ENIG continues despite evidence that this surface finish may cause catastrophic, brittle, interfacial solder joint fractures [3]- [7]. The fracture mode is characterized by crack propagation along the interface or boundary between the electroless Ni and the intermetallic layer.…”

mentioning

confidence: 99%

The effect of modifications to the nickel/gold surface finish on assembly quality and attachment reliability of a plastic ball grid array (peer review version)

Coyle¹,

Popps

Mawer

et al. 2003

IEEE Trans. Comp. Packag. Technol.

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Electrolytic and electroless Ni/Au are common pad surface finishes on area array (BGA or CSP) packages and printed wiring boards (PWB). The electroless nickel/immersion gold (ENIG) process often is implemented when there is insufficient space to allow bussing for the more common electrolytic Ni/Au plating. The ENIG process continues to be used despite evidence that it may cause catastrophic, brittle, interfacial solder joint fractures. In this investigation a plastic ball grid array (PBGA) test vehicle is used to compare quality and reliability of standard and experimentally modified ENIG surface finishes. The standard electrolytic Ni/Au surface finish is used as the control cell for the experiment. Ball shear tests and optical and scanning electron microscopy are performed on as-received and thermally preconditioned packages to evaluate package quality prior to assembly. Accelerated temperature cycling (0 +100 C and 40 +125 C) is used to evaluate solder joint attachment reliability. Detailed failure mode analysis is used to compare the fracture modes in the ball shear and thermal cycled samples in the electroless and electrolytic packages. The results are discussed in terms of the failure modes and the characteristics of the different Ni/Au surface finishes.

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mentioning

confidence: 99%

The effect of modifications to the nickel/gold surface finish on assembly quality and attachment reliability of a plastic ball grid array (peer review version)

Coyle¹,

Popps

Mawer

et al. 2003

IEEE Trans. Comp. Packag. Technol.

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show abstract

“…Even with the fatigue life reduced to approximately 7000 cycles (measured at 0/+100 °C ATC), the BGA package meets the most severe telecommunication attachment reliability requirements, that for the outside use environment [7]. However, this prediction is applicable only for the amount of degradation reported in this experiment.…”

Section: Discussionmentioning

confidence: 87%

“…Discounting early or "infant mortality" failures, ENIG components generally display satisfactory long-term solder joint attachment reliability. Such behavior is indicative of assembly quality or package quality defects, not true wear-out failures [7].…”

Section: Introductionmentioning

confidence: 99%

“…There is considerable growth in the use of the electroless nickel/immersion gold (ENIG) process [1], mostly due to densification requirements that restrict the space needed for bussing the electrolytic Ni/Au plating [2]. Widespread implementation of ENIG continues despite evidence that this surface finish may cause catastrophic, brittle, interfacial solder joint fractures [3][4][5][6][7]. Interfacial fractures occur at a relatively low defect level during assembly or early in the service life of a product.…”

Section: Introductionmentioning

confidence: 99%

“…Interfacial fractures occur at a relatively low defect level during assembly or early in the service life of a product. They have appeared under a variety of laboratory testing conditions including thermal cycling (premature failures), isothermal aging (high temperature storage), bending, shear, and mechanical shock [3,5,[7][8].…”

Section: Introductionmentioning

confidence: 99%

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The effect of variations in nickel/gold surface finish on the assembly quality and attachment reliability of a plastic ball grid array

Coyle

Wenger²,

Hodges³

et al.

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)

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Electrolytic and electroless Ni/Au are common pad surface finishes on area array (BGA or CSP) packages and printed wiring boards (PWB). The electroless nickel/immersion gold (ENIG) process often is implemented when there is insufficient space to allow bussing for the more common electrolytic Ni/Au plating. The ENIG process continues to be used despite evidence that it may cause or contribute to catastrophic, brittle, interfacial solder joint fractures. In this investigation a plastic ball grid array (PBGA) test vehicle is used to compare quality and reliability of four variations of the ENIG surface finish. The standard electrolytic Ni/Au surface finish is used as the control cell for the experiment. Ball shear tests and optical and scanning electron microscopy are performed on as-received and thermally preconditioned packages to evaluate package quality prior to assembly. Accelerated temperature cycling (0/+100 °C and -40/+125 °C) is used to evaluate solder joint attachment reliability. Detailed failure mode analysis is used to compare the fracture modes in the ball shear and thermal cycled samples in the electroless and electrolytic packages. The results are discussed in terms of the failure modes and the characteristics of the different Ni/Au surface finishes.

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The influence of room temperature aging on ball shear strength and microstructure of area array solder balls

Coyle

Solan²,

Serafino³

et al.

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

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Assembly and reliability of thermally enhanced high I/O BGA packages

Cited by 15 publications

References 2 publications

The effect of modifications to the nickel/gold surface finish on assembly quality and attachment reliability of a plastic ball grid array (peer review version)

The effect of modifications to the nickel/gold surface finish on assembly quality and attachment reliability of a plastic ball grid array (peer review version)

The effect of variations in nickel/gold surface finish on the assembly quality and attachment reliability of a plastic ball grid array

The influence of room temperature aging on ball shear strength and microstructure of area array solder balls

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