Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: pt.I. Experiment

Ogunjimi, A.O.; Mannan, Samjid H.; Whalley, D.C.; Williams, David J.

doi:10.1109/3476.558552

Cited by 15 publications

(6 citation statements)

References 4 publications

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“…The pressure range recommended by ACA manufacturers is typically very wide. To find an optimal pressure, a careful study needs to be made for every application (Ogunjimi et al , 1996; Chan and Luk, 2002).…”

Section: Introductionmentioning

confidence: 99%

The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints

Frisk

Kokko

2006

Soldering &Amp; Surface Mount Technology

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PurposeThe purpose of this study is to investigate the effect of chip and substrate thickness on the thermal cycling reliability of flip chip joints assembled with anisotropic conductive adhesives (ACA) on FR‐4 substrates.Design/methodology/approachFour test lots were assembled with two substrates and two test chips. The thicknesses of the substrates were 710 and 100 μm and the thicknesses of the chips were 480 and 80 μm. To study the effect of the bonding pressure each test lot contained four test series bonded with four different bonding pressures. The reliability of the test samples was studied using a temperature cycling test.FindingsThe reliability of the test lots varied widely during the test. The test lot with a thin substrate and thin chip demonstrated considerably better reliability than the other test lots. In addition, the test lots had different failure mechanisms. After the test delamination was found in every test lot except the one assembled with the thin chip and the thin substrate.Originality/valueThe work shows that the thermal cycling reliability of ACA flip chip joints can be markedly increased by using thinned chips or reducing the thickness of the substrate.

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Section: Introductionmentioning

confidence: 99%

The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints

Frisk

Kokko

2006

Soldering &Amp; Surface Mount Technology

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“…ACA manufacturers usually recommend a very wide pressure range to be used in the bonding process. To find the optimal pressure for different applications careful study needs to be made for every application (Chan and Luk, 2002; Ogunjimi et al , 1996).…”

Section: Introductionmentioning

confidence: 99%

Reliability of ACA bonded flip chip joints on LCP and PI substrates

Frisk

Cumini

2006

Soldering & Surface Mount Tech

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PurposeThe purpose of this study is to investigate the reliability of flip chip joints made with anisotropic conductive adhesives (ACA) on flexible polyimide (PI) and liquid crystal polymer (LCP) substrates.Design/methodology/approachSix test series using two ACAs and an LCP substrate were made with varying bonding pressure. The ACAs had the same matrix and conductive particles. To lower the CTE of one of the adhesives silica had been added to it. The reliability of the test series was studied in a temperature cycling test. The purpose of these test series was to find the optimal bonding pressure for both the adhesives used. According to the results from these initial tests, further test series were made with both LCP and PI substrates. The reliability of these test samples was studied using a temperature cycling test and a constant humidity test. The adhesion strength of the joints was studied before testing.FindingsBoth substrates had excellent reliability during the temperature cycling test. However, the reliability of the PI substrates during the constant humidity test was markedly lower than that of the LCP substrates. Additionally, the adhesion strength of the adhesives on to PI substrates was clearly less.Originality/valueThe work shows how the substrate material used affects the reliability of flip chip joints. In addition, the work shows how the addition of silica to the ACA matrix affects the reliability of the joints.

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“…The results for each type of substrate were analysed individually as the initial analysis showed this to be the most significant factor in all of the experiments and to interact strongly with the other factors. The full details of the results may be found in (Ogunjimi et al, 1996). There are three important parameters which have been derived from the raw experimental results: the average conductance of the monitored connections; the proportion of pads that met the conductivity specification, i.e.…”

Section: Assembly Trial Results and Discussionmentioning

confidence: 99%

Anisotropic conducting adhesives for electronic assembly

Whalley

Mannan

Williams

1997

Assembly Automation

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Presents some experimental and theoretical results from research exploring the design rules and relevant process parameters in the assembly of electronic components using anisotropic conductive adhesive materials. The experimental configurations studies have geometries representative of flip‐chip and micro ball grid array chip scale packaging. Evaluates a range of materials combinations, including (random filled) adhesive materials based on both thermoplastic and thermo‐setting resin systems, combined with both glass reinforced polymer printed circuit board and silver palladium thick film on ceramic substrate materials. Also presents a summary of assembly experiments which have been conducted using a specially developed instrumented assembly system. This test rig allows the measurement of the process temperatures and pressures and their relationship with the consequent bondline thickness reduction and conductivity development. Finally summarizes the capabilities of models which have been developed of the assembly process and of the final joint properties.

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Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: pt.I. Experiment

Cited by 15 publications

References 4 publications

The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints

The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints

Reliability of ACA bonded flip chip joints on LCP and PI substrates

Anisotropic conducting adhesives for electronic assembly

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