Assembly processes comparison for a miniaturized laser used for the Exomars European Space Agency mission

Ribes-Pleguezuelo, Pol; Inza, Andoni Moral; Basset, Marta Gilaberte; Rodríguez, P.; Rodríguez, Gemma; Laudisio, Marco; Galán, Miguel Á.; Hornaff, Marcel; Beckert, Erik; Eberhardt, Ramona; Tünnermann, Andreas

doi:10.1117/1.oe.55.11.116107

Cited by 16 publications

(20 citation statements)

References 7 publications

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“…After assessing a low induced stress on the bonded components, the next step was to test if the various assembled cube sizes could withstand the high loads required, as are required in some laser applications [10]. For the analysis, we contrasted a theoretical bond strength calculated by accounting for the melted bump covered area for the different initial bumps sizes (300 μm, 400 μm and 760 μm) by using alloy maximum yield strength (45 MPa for SAC305 [11]); and comparing it later with the real force required to tear apart the soldered Fig.…”

Section: Bond Strength Results and Discussionmentioning

confidence: 99%

“…Finally, the authors believe that the use of inorganic and flux-free metallic alloys provide components with better thermally conductive and radiation resistant joints (required for space applications), and more robust assemblies, when compared with formally state of the art technologies based on adhesive means [10]. …”

Section: Discussionmentioning

confidence: 99%

“…Taking into account the mass of each of the FS cube sizes and considering, as an example, loads similar to the ones described for the Exomars ESA space mission [10,14] (for which a manufactured robust laser is also required), each component would need to withstand a maximum of 0.3 N to comply with mission loads. However, as we have seen in Fig.…”

Section: Discussionmentioning

confidence: 99%

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Solderjet bumping packaging technique optimization for the miniaturization of laser devices

Ribes-Pleguezuelo

Septriani

Zhang

et al. 2017

J. Eur. Opt. Soc.-Rapid Publ.

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Background: Low-stress soldering techniques can guarantee a minimized input of thermal energy allowing for the design and later assembly of more robust and miniaturized optical devices. However, in order to build miniaturized optical devices, these small-induced stresses produced by soldering techniques have to be investigated to guarantee that the stress-induced birefringence effects do not alter the device optical properties and requirements. Methods: An analytical method that relates the stress-induced birefringence of laser components with their corresponding lasing capabilities has been compared to the real induced-stress results created in components packaged using solderjet technology. The main goal was to optimize the optical component packaging by using this low induced-stress soldering technique. The optimization was carried out by assessing components miniaturization while still assuring high robustness of the bond strength without creating a beam depolarization ratio of more than 1%. Results: The outcome of the study showed the possibility of assembling laser optical components down to sizes of around 300 μm, creating a bond strength of 5 N and higher, and a depolarization ratio much lower than the proposed target of 1%. Conclusions: Our results in terms of induced stress agreed with the finite element method result, which would imply correct post-processing laser simulations. This suggested that the solderjet bumping technique could robustly join components down to the laser emission beam size without strongly affecting the optical properties.

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Section: Bond Strength Results and Discussionmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

See 1 more Smart Citation

Solderjet bumping packaging technique optimization for the miniaturization of laser devices

Ribes-Pleguezuelo

Septriani

Zhang

et al. 2017

J. Eur. Opt. Soc.-Rapid Publ.

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“…An example of the former application would be the GEDI (Global Ecosystems Dynamics Investigation Lidar) instrument, developed for NASA's Earth Venture Instrument (EVI) space program, which uses a version of the High Output Maximum Efficiency Resonator (HOMER) laser, an Nd:YAG crystal side-pumped by seven, 4-bar G-package laser diode arrays [18]. An example of the latter application would be the ESA/ROSCOSMOS ExoMars 2020 mission to Mars, that includes a Raman Laser Spectrometer (RLS) instrument whose excitation source is an intracavity frequency-doubled DPSSL emitting at 532 nm, shown in Figure 1, pumped by a CW (continuous-wave) Q-mount diode emitting at 808 nm [19].…”

Section: Solid State Laser (Ssl)mentioning

confidence: 99%

“…Random vibrational mission limits required for components lifetime to be performed several minutes per axis[19,131].…”

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confidence: 99%

Laser Technology in Photonic Applications for Space

Guilhot

Ribes-Pleguezuelo

2019

Instruments

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The registered history of laser technologies for space application starts with the first laser echoes reflected off the Moon in 1962. Since then, photonic technologies have become very prominent in most technical development. Their presence has also dramatically increased in space applications thanks to the many advantages they present over traditional equivalent devices, such as the immunity against electromagnetic interference, as well as their efficiency and low power consumption. Lasers are one of the key components in most of those applications. In this review, we present an overview of the main technologies involving lasers that are currently deployed in space, before reviewing the requirements for lasers to be reliable in that environment before discussing the advantages and drawbacks of replacing standard technologies by newly developed photonic laser-based devices.

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Design, development, and scientific performance of the Raman Laser Spectrometer EQM on the 2020 ExoMars (ESA) Mission

Moral

Rull²,

Maurice

et al. 2019

J Raman Spectroscopy

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The Raman Laser Spectrometer (RLS) is one of the three Pasteur Payload instruments located within the rover analytical laboratory drawer (ALD), for ESA's Aurora exploration programme, ExoMars 2020 mission. The instrument will analyse the crushed surface and subsurface samples that are positioned below the Raman optical head by the ALD carousel. The RLS engineering and qualification model (EQM) was delivered to ESA at the end of 2017, after a wide technical and scientific test characterization campaign. The scientific campaign comprised instrument calibration and detailed evaluation of the scientific requirements and overall performance. For spectral calibration, continuous emission standard lamps (such as Hg‐Ar, Ne, and Xe) were utilized, as well as Raman spectra of pure liquids typically used as standards (cyclohexane and carbon tetrachloride (CCl4)). In addition, Raman spectra of the RLS calibration target (CT), a small disc of polyethylene terephthalate (PET) were obtained at various temperatures. This target, placed inside the rover, will be used for both Instrument health checks and calibration activities throughout Mars operations. For the scientific requirements and performance evaluations, several liquid and solid samples were analysed under a wide range of ambient conditions. The obtained spectral band parameters (peak position, relative peak intensity, peak width, and peak profile) were evaluated. Also, the instrument response (in terms of SNR) was characterized at different integration times and detector operating temperatures. In this paper, we provide a description of the development, verification, functional test, and overall scientific performance of the RLS instrument developed for ExoMars. Particular attention is placed on the performance of the EQM, which is the most representative instrument, in terms of engineering and functionality, of the flight model (FM) and in addition is used for performing all the mechanical, thermal, and radiation tests necessary for space qualification (for planetary applications). The data presented and analysed here, comprise part of the overall dataset obtained during the full instrument characterization campaign conducted at INTA before and during delivery and integration of the EQM in the rover ALD at TAS‐I facilities (Torino, Italy). The results obtained confirm that the full functionality and scientific performance of the RLS instrument was maintained after integration.

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Assembly processes comparison for a miniaturized laser used for the Exomars European Space Agency mission

Cited by 16 publications

References 7 publications

Solderjet bumping packaging technique optimization for the miniaturization of laser devices

Solderjet bumping packaging technique optimization for the miniaturization of laser devices

Laser Technology in Photonic Applications for Space

Design, development, and scientific performance of the Raman Laser Spectrometer EQM on the 2020 ExoMars (ESA) Mission

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