Assembly technique for a fine-pitch, low-noise interface; Joining a CdZnTe pixel-array detector and custom VLSI chip with Au stud bumps and conductive epoxy

Clayton, James E.; Chen, C.M.H.; Cook, W. R.; Harrison, Fiona A.

doi:10.1109/nssmic.2003.1352668

Cited by 9 publications

(9 citation statements)

References 5 publications

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“…An 80×80 pixel piece of 1 mm thick CdTe from Acrorad was gold stud and silver epoxy [17, 18] bump bonded to an 8080 ASIC. The pixellated contact on the anode was aluminum, which forms a Schottky contact to suppress the leakage current from the bulk but doesn’t diffuse into the CdTe material and cause the pixels to short together [19].…”

Section: Measured Performancementioning

confidence: 99%

Pixellated Cd(Zn)Te high-energy X-ray instrument

et al. 2011

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We have developed a pixellated high energy X-ray detector instrument to be used in a variety of imaging applications. The instrument consists of either a Cadmium Zinc Telluride or Cadmium Telluride (Cd(Zn)Te) detector bump-bonded to a large area ASIC and packaged with a high performance data acquisition system. The 80 by 80 pixels each of 250 μm by 250 μm give better than 1 keV FWHM energy resolution at 59.5 keV and 1.5 keV FWHM at 141 keV, at the same time providing a high speed imaging performance. This system uses a relatively simple wire-bonded interconnection scheme but this is being upgraded to allow multiple modules to be used with very small dead space. The readout system and the novel interconnect technology is described and how the system is performing in several target applications.

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Section: Measured Performancementioning

confidence: 99%

Pixellated Cd(Zn)Te high-energy X-ray instrument

et al. 2011

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“…Gold stud bumps were attached to the aluminum pad on the ASIC chip by intentionally removing the wire from a thermosonic wirebond to leave only the ball-bond. A conductive polymer epoxy bump was placed on the pads of the detector through a stencil screen [5].…”

Section: Device Descriptionmentioning

confidence: 99%

X-ray analog pixel array detector for single synchrotron bunch time-resolved imaging

Koerner

Grüner

2010

J Synchrotron Radiat

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Dynamic X-ray studies can reach temporal resolutions limited by only the X-ray pulse duration if the detector is fast enough to segregate synchrotron pulses. An analog integrating pixel array detector with in-pixel storage and temporal resolution of around 150 ns, sufficient to isolate pulses, is presented. Analog integration minimizes count-rate limitations and in-pixel storage captures successive pulses. Fundamental tests of noise and linearity as well as high-speed laser measurements are shown. The detector resolved individual bunch trains at the Cornell High Energy Synchrotron Source at levels of up to 3.7 Â 10 3 X-rays per pixel per train. When applied to turn-by-turn X-ray beam characterization, single-shot intensity measurements were made with a repeatability of 0.4% and horizontal oscillations of the positron cloud were detected.

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“…The gold stud bumps are populated onto the ASIC by Integrated Packaging Assembly Corp, while Polymer Assembly Technology provides the conductive epoxy bumps and performs the flip-chip bonding. More information on these interconnects is presented in [8].…”

Section: B Interconnectmentioning

confidence: 99%

Characterization of a large-format, fine-pitch CdZnTe pixel detector for the HEFT balloon-Borne experiment

Chen

Cook

Harrison

et al. 2004

IEEE Trans. Nucl. Sci.

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Abstract-We have developed a large-format CdZnTe pixel detector with custom, low-noise ASIC readout, for astrophysical applications. In particular, this detector is targeted for use in the High-Energy Focusing Telescope (HEFT), a balloon-borne experiment with focusing optics for 20-70 keV. The detector is a 24 44 pixel array of 498-m pitch. As a focal plane detector, uniformity from pixel to pixel is very desirable. In this paper, we present the characterization of some detector properties for the 1056 pixels on the HEFT detector. These properties include electronic noise, leakage current, spectral resolution, and count rate.

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Assembly technique for a fine-pitch, low-noise interface; Joining a CdZnTe pixel-array detector and custom VLSI chip with Au stud bumps and conductive epoxy

Cited by 9 publications

References 5 publications

Pixellated Cd(Zn)Te high-energy X-ray instrument

Pixellated Cd(Zn)Te high-energy X-ray instrument

X-ray analog pixel array detector for single synchrotron bunch time-resolved imaging

Characterization of a large-format, fine-pitch CdZnTe pixel detector for the HEFT balloon-Borne experiment

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