Assessing the replacement of lead in solders: effects on resource use and human health

Almeida, C.M.V.B.; Madureira, Marco Antonio; Bonilla, Sílvia H.; Giannetti, Biagio F.

doi:10.1016/j.jclepro.2012.08.002

Cited by 27 publications

(9 citation statements)

References 36 publications

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“…This changed in recent years as LCA practitioners are starting to include a quantified handprint to the otherwise footprint-oriented approach [13][14][15][16][17][18]. When focusing on one Area of Protection, it is possible to directly compare the handprint to the footprint [15,16,[18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Quantifying the handprint—Footprint balance into a single score: The example of pharmaceuticals

et al. 2020

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Life Cycle Assessment typically focuses on the footprint of products and services, expressed on three Areas of Protection (AoP): Human Health, Ecosystems and Resources. While the handprint is often expressed qualitatively, quantified handprints have recently been compared directly to the footprint concerning one AoP: Human Health. We propose to take this one step further by simultaneously comparing the quantified handprint and footprint on all AoPs through normalization and weighting of the results towards a single score. We discuss two example cases of a pharmaceutical treatment: mebendazole to treat soiltransmitted helminthiases and paliperidone palmitate to treat schizophrenia. Each time, treatment is compared to 'no treatment'. The footprint of health care is compared to the handprint of improved patient health. The handprint and footprint were normalized separately. To include sensitivity in the normalization step we applied four sets of external normalization factors for both handprint (Global Burden of Disease) and footprint (ReCiPe and PROSUITE). At the weighting step we applied 26 sets of panel weighting factors from three sources. We propose the Relative Sustainability Benefit Rate (RSBR) as a new metric to quantify the relative difference in combined handprint and footprint single score between two alternatives. When only considering the footprint, the first case study is associated with an increased single score burden of treatment compared to 'no treatment', while in the second case study treatment reduces the single score burden by 41.1% compared to 'no treatment'. Also including the handprint provided new insights for the first case study, now showing a decrease of 56.4% in single score burden for treatment compared to 'no treatment'. For the second case study the reduction of single score burden was confirmed as the handprint burden was also decreased because of treatment by 9.9%, reinforcing the findings.

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Section: Introductionmentioning

confidence: 99%

Quantifying the handprint—Footprint balance into a single score: The example of pharmaceuticals

et al. 2020

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“…The most adopted GSCM practices are internal environmental management, investment recovery and RL Almeida et al (2013) Applied emergy synthesis to assess the impact of manufacturing soft solder on the environment and on human health, including evaluations with and without RL …”

Section: High-tech Companiesmentioning

confidence: 99%

Reverse logistics drivers: empirical evidence from a case study in an emerging economy

Bouzon

Spricigo

Rodriguez

et al. 2015

Production Planning & Control

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Academic and corporate interest in reverse logistics (RL) has risen considerably in recent years. In this context, the objective of this study was to identify the drivers that enable RL practice in an emerging economy. Firstly, international peer-reviewed publications on RL were used to develop a RL environment framework representing the main RL internal and external influences. Secondly, a case-based research was conducted in a large manufacturing company located in Southern Brazil. The results indicated that the most cited driver in the RL literature, the government and legislation, was not a main influence on the studied company. Environmental legislation is still limited in the country and struggles to provide incentives to increase materials recycling. An economic factor related to materials value recovery was also found to drive the backward flow. Finally, knowledge of the RL driving forces may support industries to better implement and manage reverse flows and to bridge the gap between existing and future solutions for reverse supply chains.

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“…One fundamental step of WEEE recycling processes is the disassembly of such equipment in its constituents, such as Printed Circuit Boards (PCBs). Despite accounting for only about 6% of the total weight of WEEE, PCBs might be considered a high value waste, namely a source for copper (Bleiwas and Kelly, 2001;Das et al, 2009), and even tin and lead, which are still found in solders (Almeida et al, 2013). However, PCBs also contain several toxic substances like lead, beryllium, cadmium, arsenic and even -in the case of older PCBs -brominated flame retardants; several researches have focused on strategies for recovering the precious metals and removing such harmful elements, often using high tech equipment and demanding large investments (Hanafi et al, 2012).…”

Section: Introductionmentioning

confidence: 99%

Disassembly of waste printed circuit boards using air heating and centrifugal force

Rubin

Castro

Brandão

2019

REGET

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Waste electrical and electronic equipment is a significant source of material that can contribute to reduce environmental impacts associated to extraction and discard stages; therefore, it is necessary to develop efficient recycling processes for components such as Printed Circuit Boards (PCBs). Current methods for PCB recycling may be optimized by previous disassembly of such components. In the work reported here, an especially designed and manufactured centrifuge was employed to disassemble PCBs from power supplies (PS-PCBs) and memory chips (ME-PCBs) of personal computers (PCs), through combination of hot air flow and centrifugal force. The results showed that the device was capable of separating tin solder, electronic components (EC) and PCB substrate, as long as hazardous components and plastic parts are previously removed. A scanning electron microscope (SEM) with combined energy dispersive X-ray (EDX) analyzer showed that the recovered solder had under 3%wt of contamination; therefore, it can be employed in the production of new soldering material, replacing the more commonly used solder dross. EC recovery rates were up to 94%wt for PS-PCBs and 32%wt for ME-PCBs, and once components such as inductors were not visibly damaged in the process, possibilities of reusing recovered components may be further investigated.

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Assessing the replacement of lead in solders: effects on resource use and human health

Cited by 27 publications

References 36 publications

Quantifying the handprint—Footprint balance into a single score: The example of pharmaceuticals

Quantifying the handprint—Footprint balance into a single score: The example of pharmaceuticals

Reverse logistics drivers: empirical evidence from a case study in an emerging economy

Disassembly of waste printed circuit boards using air heating and centrifugal force

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