Assessment of post-CMP cleaning mechanisms using statistically-designed experiments

Zhang, G.; Burdick, G. M.; Dai, F.; Bibby, T.; Beaudoin, Stephen P.

doi:10.1016/s0040-6090(98)01038-4

Cited by 48 publications

(32 citation statements)

References 9 publications

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“…In agreement with the literature (Moumen and Busnaina, 2001;Moden et al, 1989;Zhang et al, 1998), which indicates that higher brush rotational speeds tend to increase cleaning effectiveness, Figs. 7 and 13 show that g tends to increase with x or remain fairly constant if x is large enough for the bristles to cover effectively the area to sweep.…”

Section: Summary and Additional Remarkssupporting

confidence: 92%

“…Most of the research corroborates the typical behaviour of brushing processes: higher rotational speeds of the brush (Moumen and Busnaina, 2001;Moden et al, 1989;Zhang et al, 1998), pressures or penetrations (Moumen andBusnaina, 2001;Moden et al, 1989;Burdick et al, 2003), and cleaning times (Moumen and Busnaina, 2001;Zhang et al, 1998) improve cleaning effectiveness.…”

Section: Related Worksupporting

confidence: 66%

“…7b). The literature (Moumen and Busnaina, 2001;Zhang et al, 1998) also indicates that longer times improve cleaning effectiveness. This work also shows that lower sweeper speeds (i.e., longer cleaning times) tend to increase g (Fig.…”

Section: Summary and Additional Remarksmentioning

confidence: 99%

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Effectiveness of gutter brushes in removing street sweeping waste

2010

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Section: Summary and Additional Remarkssupporting

confidence: 92%

Section: Related Worksupporting

confidence: 66%

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Effectiveness of gutter brushes in removing street sweeping waste

2010

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“…The velocity profile between the substrate surface and the brush surface is usually assumed to be linear for simplicity [1][2][3]. However, the flow field comprised by the substrate and brush actually form a thin layer fluid flow because the brush usually is located very close to the wafer surface to generate a larger drag force.…”

Section: Drag Forcementioning

confidence: 99%

“…The currently used post-CMP cleaning techniques include brush scrubbing [1][2][3], ultrasonic and megasonic cleaning [4], fluid jet cleaning [5], laser heating [6] and chemical dissolution [7]. All of these techniques have practical limitations.…”

Section: Introductionmentioning

confidence: 99%

Modeling of Particle Removal using Non-contact Brush Scrubbing in Post-CMP Cleaning Processes

Chein

Liao

2006

The Journal of Adhesion

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Particle removal using non-contact brush scrubbing for post-CMP (Chemical Mechanical Planarization) cleaning is investigated analytically. The removal of SiO 2 and Al 2 O 3 particles adhered onto SiO 2 film coated on the wafer surface are considered. The cleaning fluid (H 2 O=NH 4 OH ¼ 1:25 and 1:200) flowing between the brush and wafer surface is treated as a thin-film fluid flow. The flow field details and its effect on the drag force acting on the adhered particles are discussed. In addition to the drag force, the electrical double layer (EDL) and thermophoretic force effects on particle removal are also considered. It was found that the dominant force in achieving particle removal using a rolling mechanism is the drag force. The EDL and thermophoretic forces have an insignificant effect on particle removal. Based on the results from this study, particles of submicron size can be removed from a wafer surface using higher brush rotation speed and pure deionized (DI) water as the cleaning fluid.

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