2000
DOI: 10.1016/s0041-624x(99)00096-7
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Assessment of the adhesion quality of fusion-welded silicon wafers with nonlinear ultrasound

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Cited by 37 publications
(15 citation statements)
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“…The spring model mentioned above provides an idea to use ultrasonic wave as a tool to test the adhesion quality of interface, since the ultrasonic wave is one kind of mechanical wave. A. Wegner [14] believes the an-harmonic wave is caused by weak bonds and manifests itself at high dynamic strains exerted by the ultrasonic waves, and proposed a distortion factor as a quantitative index for characterizing the adhesion quality of fusion-welded silicon wafers. L. Czarnecki [15] mainly uses the changes of a mean square value parameter (MS) and the value of variation coefficient (CV) of MS to characterize the propagation of ultrasonic waves through the polymer coating and concrete substrate system.…”
Section: Introductionmentioning
confidence: 99%
“…The spring model mentioned above provides an idea to use ultrasonic wave as a tool to test the adhesion quality of interface, since the ultrasonic wave is one kind of mechanical wave. A. Wegner [14] believes the an-harmonic wave is caused by weak bonds and manifests itself at high dynamic strains exerted by the ultrasonic waves, and proposed a distortion factor as a quantitative index for characterizing the adhesion quality of fusion-welded silicon wafers. L. Czarnecki [15] mainly uses the changes of a mean square value parameter (MS) and the value of variation coefficient (CV) of MS to characterize the propagation of ultrasonic waves through the polymer coating and concrete substrate system.…”
Section: Introductionmentioning
confidence: 99%
“…Nondestructive testing techniques (NDT) such as ultrasonics, eddy current, thermography, etc., are commonly used for the inspection of the adhesion of joined materials [4]. Among them, ultrasound is one of the most attractive techniques for monitoring the adhesive bonding.…”
Section: Introductionmentioning
confidence: 99%
“…Biwa et al [11] reported that the values of normal and tangential interfacial stiffness of the contacting interfaces are functions of the frequency as well as the contact pressure. Wegner et al [4] presented an ultrasonic technique to monitor the quality of the diffusion bond silicon wafer by measuring the anharmonic content of a transmitted ultrasonic wave. Lavrentyev and Beals [12] studied the feasibility of ultrasonic measurement of the diffusion bond strength between two steel blocks by correlating the interfacial stiffness measured ultrasonically to the mechanically measured bond strength.…”
Section: Introductionmentioning
confidence: 99%
“…This effect is known as the contact acoustic nonlinearity (CAN), and it has been the topic of much research work concerning the characterization of closed cracks or imperfect bond interfaces [1]. Earlier theoretical investigations [2][3][4] predicted that a weak or incompletely bonded interface will generate high second harmonics when subjected to sufficiently intense acoustic energy, and previous experiments have indicated that acoustic harmonic generation occurs on various types of interface, such as unbounded interfaces [5] microstructural changes [6][7][8][9], cracks [10][11][12] and adhesive joints [13,14].…”
Section: Introductionmentioning
confidence: 99%