2004
DOI: 10.1063/1.1804601
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Atom chips: Fabrication and thermal properties

Abstract: Neutral atoms can be trapped and manipulated with surface mounted microscopic current carrying and charged structures. We present a lithographic fabrication process for such atom chips based on evaporated metal films. The size limit of this process is below 1µm. At room temperature, thin wires can carry more than 10 7 A/cm 2 current density and voltages of more than 500V. Extensive test measurements for different substrates and metal thicknesses (up to 5 µm) are compared to models for the heating characteristi… Show more

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Cited by 90 publications
(94 citation statements)
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“…Present atom chips are single layer devices [8], sometimes combined with other structures, either macroscopic [9] or built from a combination of chips fabricated on separate substrates [10,11], limiting the freedom in designing the trapping and manipulation potentials. In this letter we present the implementation of a multi-layer atom chip ( Fig.…”
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confidence: 99%
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“…Present atom chips are single layer devices [8], sometimes combined with other structures, either macroscopic [9] or built from a combination of chips fabricated on separate substrates [10,11], limiting the freedom in designing the trapping and manipulation potentials. In this letter we present the implementation of a multi-layer atom chip ( Fig.…”
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confidence: 99%
“…Our atom chips are fabricated on commercial 700 µm thick p-type Si-wafers with a 100 nm thermal oxide layer for electrical isolation [8]. We start by depositing alignment marks which allow to superimpose the different lay- ers with sub-micron precision.…”
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“…12 Integration with a SiN x optical layer provides a path towards a monolithic atom-cavity chip with integrated atomic and photonic functionality. Indeed, owing to its moderately high index of refraction ͑n ϳ 2.0-2.5͒ and large transparency window ͑6 m Ͼ Ͼ 300 nm͒, 13,14 SiN x is an excellent material for the on-chip guiding and localization of light.…”
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confidence: 99%
“…On the other hand, for sufficiently large intensities the laser power absorbed by the nanotip, as determined by the imaginary part of ǫ L , will cause it to melt. Assuming that the nanotip has a good thermal contact conductance (e.g., comparable to achievable values for wires in atom chips [20]) with some substrate, we estimate that incident laser intensities exceeding 10 mW/µm 2 can be used for silver nanotips at λ L = 780 nm [21]. These two considerations set a lower bound for the tip size z 0 of around hundreds of picometers.…”
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confidence: 99%