Corrosion of aluminum in a system of engineered copper particles was studied in order to elucidate the nature of the interactions between multiple pitting sites. Single copper particles were fabricated on isolated, thin-film aluminum electrodes to enable independent measurements of excess anodic and cathodic currents flowing during open circuit exposures to dilute aqueous chloride solutions. In-situ fluorescence microscopy allowed imaging of local changes in solution pH during the exposure. Under the experimental conditions explored here, the anodic dissolution of aluminum beneath the majority of particles was balanced by cathodic reactions on the same electrode. However, excess anodic currents were also observed on some single electrodes due to accelerated dissolution of aluminum beneath the copper particles. These excess anodic currents were balanced by cathodic currents distributed between the other electrodes. Fluctuations in the excess anodic currents were correlated with fluctuations in the open circuit potential and with localized increases in solution pH above each of the copper particles. The transient nature of this accelerated dissolution suggests that it may evolve under anodic control.Localized corrosion at particles in alloys is common, 1-16 but the details of how anodic and cathodic currents and solution pH evolve in a system containing multiple pitting sites is unknown. Interactions between pitting sites at particles in alloys 17, 18 and in macroscopic wire electrodes 19-21 have been investigated. One set of studies showed that when pitting is driven by polarization of particular electrodes, aggressive solution chemistries can damage the oxide on nearby electrodes and influence pit initiation at these remote sites. 19,20 Under free corrosion conditions, pitting sites on isolated Al wires displayed fluctuations in potential and current and required cathodic current from remote sites. 21 The complex microstructure found in typical alloys makes it difficult to predict where pits will develop, and whether balancing cathodic reactions at remote sites are needed for pit stabilization. 10,14,15 Model alloys have been employed to investigate several aspects of pitting such as Cu redistribution, 22 galvanic coupling, 23-26 and alkalization. 22, 27-29 The random particle size and distribution in aluminum alloys results in particle densities and anode to cathode area ratios that are not independently controlled. Furthermore, real-time, simultaneous measurements of currents at multiple pitting sites are extremely difficult.In an effort to elucidate the mechanistic details of the pitting process, pit propagation has been investigated using five individual pure Al thin film electrodes, each containing a single engineered Cu particle, as a model system for Cu-rich particles in Al-Cu alloys. This approach allows independent control of some of the variables thought to control pitting behavior in real alloys, in particular, the initial particle/matrix composition, cathode/anode area ratio, and particle distribution...