properties render MNLs as a nearly perfect dielectric material that is expected to considerably improve the electron transport properties of Si based microelectronic devices. Previous studies demonstrated that the use of a MNL as the dielectric layer onto a Si substrate doubled the carrier mobility of graphene field effect transistors (FETs) and increased their transconductance several fold. [3] It also improves the gate control capability of carbon nanotubes (CNTs) FETs by suppressing gate leakage current and decreasing subthreshold slope. [4] In particular, MNLs can replace polymers as dielectric media in flexible electronics. [5,6] Compared with polymer insulators, MNLs not only improve the electron transport properties (because of their higher dielectric constant), but also reduce the effect of elastic mismatch because mica and Si have similar mechanical properties. [7] These make MNLs potentially excellent candidates for Si based flexible devices as dielectric components. In most electronic devices, an MNL is mechanically bonded onto a Si substrate. Thus, the adhesion between the MNL and Si substrate determines the reliability and life of the electronic devices. [8] This is especially important for flexible electronic devices with MNLs that frequently experience bending, twisting and stretching. [9] Characterization of the adhesion of MNLs on a flat substrate is challenging. Previous studies often used the atomic force microscopes (AFM) to measure the adhesion. [10] AFM directly measures the adhesive force of a target material with the AFM tip, rather than the adhesion energy that characterizes the adhesion. To evaluate the adhesion energy of graphene on a flat substrate, a blister method was used. [11] However, the sample preparation in the blister method is relatively long, which is not applicable for MNLs because they can be heavily contaminated during a lengthy preparation process. In situ scanning electron microscope (SEM) peeling is a possible alternative, but electron beam irradiation could considerably affect the surface status of MNL samples. [12,13] The peeling method is also inconvenient for characterising the effect of environmental conditions, such as temperature and humidity, on the adhesion that is the important knowledge for MNL based sensor design and development. [14] In our previous work, [15] a bridging method was developed based on nanomanipulation under an optical microscope, with Mica nanolayers (MNL) are a new dielectric material that can improve the electron transport properties of Si based microelectronic devices. However, the mechanical reliability of such devices is not well understood because measurement of the adhesion between an MNL and a Si substrate is insufficiently accurate. The recent work reports a bridging method that is developed based on the linear beam theory and can characterize the adhesion of MNL on a mica substrate in a reasonably accuracy. In this work, the accuracy of the bridging method is improved by using a nonlinear mechanical model. 15 MNL specimens are mea...