Atomic force microscopy ͑AFM͒ and high-resolution transmission electron microscope ͑HRTEM͒ cross section imaging of individual gas cluster ion impact craters on Si͑100͒ and Si͑111͒ substrate surfaces is examined. The comparison between 3 and 24 kV cluster impacts from Ar and O 2 gas sources is shown. Results for low fluence (10 10 ions/cm 2 ) 24 kV Ar individual cluster impacts onto a Si͑100͒ and Si͑111͒ substrate surfaces are compared with hybrid molecular dynamics ͑HMD͒ simulations. A HMD method is used for modeling impacts of Ar n (nϭ135, 225͒ clusters, with energies of 24 -50 eV/atom, on Si͑100͒ and Si͑111͒ surfaces. On a Si͑100͒, craters are nearly triangular in cross section, with the facets directed along the close-packed ͑111͒ planes. The Si͑100͒ craters exhibit four-fold symmetry as imaged by cross-sectional HRTEM, and AFM top view, in agreement with modeling. In contrast, the shape of craters on a Si͑111͒ shows a complicated six-pointed shape in the modeling, while AFM indicates three-fold symmetry of the impact. The lower energy 3 kV individual cluster impacts reveal the same crater shape in HRTEM cross section for both Ar and O 2 gas clusters, but with shallower crater depth than for the higher-energy impacts. The kinetics of the Ar and O 2 crater impacts may explain the successful use of higher-energy cluster impacts for etching material of higher initial surface roughness followed by the lower-energy impacts as an effective finishing step to achieve smoother surfaces.